Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Wenlai Xia"'
Shearo-caloric effect enhances elastocaloric responses in polymer composites for solid-state cooling
Autor:
Shixian Zhang, Yuheng Fu, Xinxing Nie, Chenjian Li, Youshuang Zhou, Yaqi Wang, Juan Yi, Wenlai Xia, Yiheng Song, Qi Li, Chuanxi Xiong, Suxin Qian, Quanling Yang, Qing Wang
Publikováno v:
Nature Communications, Vol 15, Iss 1, Pp 1-9 (2024)
Abstract Room-temperature elastocaloric cooling is considered as a zero-global-warming-potential alternative to conventional vapor-compression refrigeration technology. However, the limited entropy and large-deformation features of elastocaloric poly
Externí odkaz:
https://doaj.org/article/f1e1bf3273f24436b2164ac7fcff8602
Publikováno v:
Energies, Vol 16, Iss 9, p 3838 (2023)
Paraffin phase change materials (PCMs) exhibit great potential in battery thermal management (BTM); nevertheless, their application has been hampered by the handicap of low thermal conductivity, leakage, and volume expansion during phase transition.
Externí odkaz:
https://doaj.org/article/dad21c87ceda47cb84d987434b539bfe
Publikováno v:
Applied Surface Science. 615:156376
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::46a8a57d95450180aa457119fe79f95e
https://doi.org/10.1016/j.apsusc.2023.156376
https://doi.org/10.1016/j.apsusc.2023.156376
Autor:
Wenlai Xia, Chenjian Li, Shixian Zhang, Xuelin Wang, Shan Wang, Quanling Yang, Wei Li, Chuanxi Xiong, Jing Huang, Qing Wang
Publikováno v:
Small. :2300385
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3dab180b2c6dc18740b1a617ebbcc886
https://doi.org/10.1002/smll.202300385
https://doi.org/10.1002/smll.202300385
Autor:
Junyu Chen, Shixian Zhang, Yuhao Wei, Juan Yi, Weitao Pang, Haoyue Zhang, Yuheng Fu, Chenjian Li, Wenlai Xia, Chuanxi Xiong
Publikováno v:
Composites Science and Technology. 233:109920
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4bd31456f68ffdbdcebd2c7ad66f5e66
https://doi.org/10.1016/j.compscitech.2023.109920
https://doi.org/10.1016/j.compscitech.2023.109920