Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Wenkai Tao"'
Autor:
Li Wang, Guangru Bai, Xiaowei Wang, Jing Zhao, Cheng Gao, Jiacan Wang, Fan Xiao, Wenkai Tao, Pan Song, Qianyu Qiu, Jinlei Liu, Zengxiu Zhao
Publikováno v:
Nature Communications, Vol 15, Iss 1, Pp 1-8 (2024)
Abstract Strong field ionization injects a transient vacancy in the atom which is entangled to the outgoing photoelectron. When the electron is finally detached, the ion is populated at different excited states with part of coherence information lost
Externí odkaz:
https://doaj.org/article/33f45a588e3042fd9749edf8b0a2e28f
Publikováno v:
HortScience, Vol 59, Iss 2 (2024)
Tea (Camellia sinensis L.) is an important cash crop. In the context of climate change, analyzing the current distribution of tea trees and climate change environmental variables to predict the potential distribution area of tea trees in the future c
Externí odkaz:
https://doaj.org/article/cdfa4c01d6a54d78af23d047a35b4b19
Publikováno v:
Plants, Vol 13, Iss 5, p 631 (2024)
Floral scent (FS) plays a crucial role in the ecological functions and industrial applications of plants. However, the physiological and metabolic mechanisms underlying FS formation remain inadequately explored. Our investigation focused on elucidati
Externí odkaz:
https://doaj.org/article/b6ac3300cf61402b813a059b66033a42
Autor:
Wenkai Tao, Li Wang, Pan Song, Fan Xiao, Jiacan Wang, Zhigang Zheng, Jing Zhao, Xiaowei Wang, Zengxiu Zhao
Publikováno v:
Chinese Physics Letters.
We demonstrate that the extreme ultraviolet free induction decay emission can be significantly enhanced by employing isolated attosecond pulses. In this work, the near infrared pulses are applied to excite the neon atoms into Rydberg states coherentl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ebae48d1315526773eaaadf7b2c91155
https://doi.org/10.1088/0256-307x/40/6/063201
https://doi.org/10.1088/0256-307x/40/6/063201
Publikováno v:
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
Conductive adhesives are generally considered to be one of the strongest candidates for replacement of solder in electronics industry. However, some problems related to the performance have so far limited wider applications of conductive adhesives. O
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f05359a2226702d5f3480d679ed616b0
https://doi.org/10.1109/icept.2010.5582437
https://doi.org/10.1109/icept.2010.5582437
With fast development of electronic packaging, the conductive adhesives were widely used in surface mount and chip interconnection. As an alternative to solder, it has many advantages, such as low processing temperature, less environment contaminatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::477cb7ce1aa89a373ee231d55eee4c54
Autor:
Zhaonian Cheng, Wenkai Tao, Lili Zhang, Yulai Gao, Yan Zhang, Qijie Zhai, Johan Liu, Cristina Andersson
Publikováno v:
2008 International Conference on Electronic Packaging Technology & High Density Packaging.
This paper investigates a composite solders obtained by adding Sn-3.0Ag-0.5Cu (SAC) nano-particles into conventional eutectic Sn-58Bi solder paste. The microstructure analysis and the measurement of the Vickers microhardness have been carried out. Ut
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::85d895f5eee62e48bc46709a321469f7
https://doi.org/10.1109/icept.2008.4607057
https://doi.org/10.1109/icept.2008.4607057
Publikováno v:
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP); 2010, p225-228, 4p
Publikováno v:
International Symposium on Advanced Packaging Materials: Microtech, 2010. APM 10; 2010, p74-77, 4p