Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Wenjiang Zou"'
Autor:
Jian, Yang, Jianyu, Yuan, Wenwen, Li, Yuchen, Yang, Zihan, Tu, Jintao, Liu, Wenjiang, Zou, Wei, Mao, Yanlin, Hu
Publikováno v:
Journal of Physics: Conference Series; 2024, Vol. 2854 Issue 1, p1-14, 14p
Autor:
Hongliang Feng, Bo Chen, Xinyu Ren, Haishui Ren, Wenwen Li, Chong Pei, Yuanwei Zhang, Sisi Li, Wenjiang Zou, Huaping Xiong, Yaoyong Cheng
Publikováno v:
International Journal of Applied Ceramic Technology.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a9bc96529c128ab17649bcadb881b6b8
https://doi.org/10.1111/ijac.14367
https://doi.org/10.1111/ijac.14367
Publikováno v:
2013 International Conference on Optoelectronics and Microelectronics (ICOM).
By using ANASYS finite element analysis software to analyze the first three order resonance frequencies and strain values of the porous and porous free structure of the acoustic sensing chips, the optimization of the structure indicates: the resonanc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::66aba28ef9359b28a7bc9cd0d00592f1
https://doi.org/10.1109/icoom.2013.6626490
https://doi.org/10.1109/icoom.2013.6626490
Publikováno v:
2013 International Conference on Optoelectronics & Microelectronics (ICOM); 2013, p56-61, 6p
Autor:
Feng, Hongliang1 (AUTHOR) hlldanh@163.com, Chen, Bo1 (AUTHOR) chenbo621@sina.com, Ren, Xinyu1 (AUTHOR), Ren, Haishui1 (AUTHOR), Li, Wenwen1 (AUTHOR), Pei, Chong1 (AUTHOR), Zhang, Yuanwei1 (AUTHOR), Li, Sisi1 (AUTHOR), Zou, Wenjiang1 (AUTHOR), Xiong, Huaping1 (AUTHOR), Cheng, Yaoyong1 (AUTHOR)
Publikováno v:
International Journal of Applied Ceramic Technology. Jul2023, Vol. 20 Issue 4, p2131-2136. 6p.
Autor:
Feng, Hongliang, Chen, Bo, Ren, Haishui, Xiong, Huaping, Li, Wenwen, Cheng, Yaoyong, Zou, Wenjiang
Publikováno v:
Welding in the World; Oct2020, Vol. 64 Issue 10, p1771-1778, 8p
Autor:
Ashish, Shanmuganantham, T.
Publikováno v:
2014 International Conference on Green Computing Communication & Electrical Engineering (ICGCCEE); 2014, p1-4, 4p
Publikováno v:
2013 International Conference on Optoelectronics & Microelectronics (ICOM); 2013, p1-5, 5p
Publikováno v:
2013 International Conference on Optoelectronics & Microelectronics (ICOM); 2013, p1-5, 5p