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Autor:
Kousik Ganesan, Rahul Manepalli, Marcel Wall, Andrew Wentzel, Helme Castro, Wencaho Li, Thomas Heaton
Publikováno v:
ECS Meeting Abstracts. :1250-1250
Low cost electroplating of copper to create Fine Line Space (FLS) features and Blind Micro Via’s (BMV) is a key technology element of high density substrates for integrated circuit packaging. In this work, we demonstrate a capable deposition method