Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Wen-yeong Huang"'
Autor:
Li-Kuo Wang, Sian-Yi Yang, Wen-Yeong Huang, Yang-Hsien Lee, Keh-Moh Lin, Yi-Wen Kuo, Guan-ting Chen
Publikováno v:
Renewable Energy. 83:749-758
In this study, electroluminescent (EL), eddy current (EC) technology, and I–V measurements were used to analyze the soldering-induced damages on crystalline silicon solar modules fabricated by hot-air soldering method. Experimental results reveal t
Publikováno v:
Advanced Materials Research. 1110:222-225
In this study, AZO films were deposited by RF sputtering technique. Then, the state of residual stress in the AZO films was investigated by using spectroscopic ellipsometry (SE) and XRD methods. Our experiments show that a suitable SE model could pro
Publikováno v:
Advanced Materials Research. :188-191
To find out the important factors which decisively affect the soldering quality of photovoltaic modules, solar cells were soldered under different conditions (different temperatures, PbSn vs. SnAgCu solder, manual vs. semi-automatic). Experimental re
Publikováno v:
Advanced Materials Research. :90-93
In this study, the quality degradation of multi-crystalline silicon photovoltaic (PV) modules during the aging process was observed by using electroluminescence (EL) technology and IV curve measurements in order to find out the occurring timing of da
Autor:
Hwa-Teng Lee, Wen Yeong Huang
Publikováno v:
MATERIALS TRANSACTIONS. 50:899-908
This paper examines the effects of the thermal storage time and Cu addition on the adhesive strength and microstructure of lead-free Sn3.0 mass% Ag-1.5 mass% Sb-xCu solder joints. The experimental results show that the adhesive strength of the as-sol
Autor:
Wen-yeong Huang, 黃文勇
97
Sn-3.5 wt% Ag lead-free solder is recognized as having an excellent potential for soldering applications. However, when the Ag content in the solder exceeds 3.5 wt%, the Ag3Sn intermetallic compound (IMC) formed within the interface between t
Sn-3.5 wt% Ag lead-free solder is recognized as having an excellent potential for soldering applications. However, when the Ag content in the solder exceeds 3.5 wt%, the Ag3Sn intermetallic compound (IMC) formed within the interface between t
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/08788420121236697757
Autor:
ZHENG,CHENG-XUAN, 鄭丞軒
106
In recent years, technology for flexible conductive material as electrodes has been rapidly developed and common. ITO (Indium Tin Oxide) has been the mostly used material for the optoelectronics industry for a period of time. Driven by the d
In recent years, technology for flexible conductive material as electrodes has been rapidly developed and common. ITO (Indium Tin Oxide) has been the mostly used material for the optoelectronics industry for a period of time. Driven by the d
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/x8rgzp
Autor:
Chih-kai Hsu, 徐至凱
103
With the flourishing development of the opto-electrical industry as well as related research, the demand for TCOs thin film has greatly increased. Among them, the ITO films have a large share on the market. AZO is a non-indium material with
With the flourishing development of the opto-electrical industry as well as related research, the demand for TCOs thin film has greatly increased. Among them, the ITO films have a large share on the market. AZO is a non-indium material with
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/94a5pu
Autor:
Liu Feng
Selected, peer reviewed papers from the 2012 International Conference on Materials Engineering and Automatic Control (ICMEAC 2012), August 27-28, 2012, Jinan, China