Zobrazeno 1 - 10
of 40
pro vyhledávání: '"Wen-Long Lu"'
Autor:
Ze-qiang SHAO, Cong-cong ZHENG, Johannes A. POSTMA, Wen-long LU, Qiang GAO, Ying-zhi GAO, Jin-jing ZHANG
Publikováno v:
Journal of Integrative Agriculture, Vol 20, Iss 8, Pp 2240-2254 (2021)
Nitrogen (N) fixation by legumes and nitrogen transfer to cereals have been considered as important pathways for overyielding and higher N use efficiency in cereal/legume intercropping systems. However, the extent to which root morphology contributes
Externí odkaz:
https://doaj.org/article/e1fefaf39614469aa85f306dd503ad6f
Publikováno v:
Shock; Jun2024, Vol. 61 Issue 6, p841-847, 7p
Autor:
Jian-Wen Dong, Zong Qin, Wei-Shi Zheng, Zhi-Bin Fan, Ze-Ming Chen, Yan Liu, Xia Liu, Wen-Long Lu, Kun-Yuan Xin
Publikováno v:
Holography, Diffractive Optics, and Applications XII.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::72819e6b26dc4ac15c2023f13fd2ed5f
https://doi.org/10.1117/12.2642511
https://doi.org/10.1117/12.2642511
Publikováno v:
Journal of Hydroinformatics. 22:900-915
Accurate daily runoff prediction plays an important role in the management and utilization of water resources. In order to improve the accuracy of prediction, this paper proposes a deep neural network (CAGANet) composed of a convolutional layer, an a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cac4b9205e5ad755bf34b1c97fbbba35
https://doi.org/10.2166/hydro.2020.017
https://doi.org/10.2166/hydro.2020.017
Autor:
Wei Ming, Wen-Long Lu, Christophe Pannecouque, Jiong Chen, Hai-Feng Wang, Ya-Qi Xiao, Sha Hu, Shuang-Xi Gu, Yuan-Yuan Zhu, Fen-Er Chen
Publikováno v:
European Journal of Medicinal Chemistry. 248:115114
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d1b46bee827b18ac11a5c5e2ccdea1a8
https://doi.org/10.1016/j.ejmech.2023.115114
https://doi.org/10.1016/j.ejmech.2023.115114
Publikováno v:
Microelectronics Reliability. 136:114657
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c7869d69c87bbb6d30f657151fe6bf9d
https://doi.org/10.1016/j.microrel.2022.114657
https://doi.org/10.1016/j.microrel.2022.114657
Autor:
Wen-Long Lu, Peng Yang, Min-Lung Huang, Hung-Jung Tu, Jen-Kuang Fang, Huang-Hsieh Chang, Cher-Min Fong, Jhao-Cheng Chen
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In this research, a good solution to achieve high quality fine-pitch Re-Distribution Layer (RDL) has been demonstrated by controlling bottom Radio Frequency (RF) power of plasma treatment on Polyimide (PI). The experimental results shows both overly
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::09aacd11eb1ab0ccaca970470a13cf06
https://doi.org/10.1109/ectc32696.2021.00024
https://doi.org/10.1109/ectc32696.2021.00024
Publikováno v:
ICCE-TW
In this study, we used AdaGrad gradient descent method in optimizer for image deep learning, and compare with Adam gradient descent methods. After processing over six thousand huge database of through silicon via images, AdaGrad has shown a fast conv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a1452d2995fd459143b61eccfeadc62e
https://doi.org/10.1109/icce-taiwan49838.2020.9258085
https://doi.org/10.1109/icce-taiwan49838.2020.9258085
Publikováno v:
ICCE-TW
The 5th Generation wireless systems popularity will push the package development into a high performance and heterogeneous integration form Packaging process further developed it in a larger area and higher integration complexity for future 5G connec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a9e9eb51ce14e27e3771e4caf5a532bc
https://doi.org/10.1109/icce-taiwan49838.2020.9258334
https://doi.org/10.1109/icce-taiwan49838.2020.9258334
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
The 5th Generation (5G) wireless systems popularity will push the package development into a high performance and heterogeneous integration form. For high I/O density and high performance packages, the promising Fan Out Chip on Substrate (FOCoS) prov
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8f5b08720a8f5709aea809140f692a8a
https://doi.org/10.1109/ectc32862.2020.00055
https://doi.org/10.1109/ectc32862.2020.00055