Zobrazeno 1 - 10
of 24
pro vyhledávání: '"Wen-Jie Zhai"'
Publikováno v:
Nature Communications, Vol 7, Iss 1, Pp 1-13 (2016)
Liver tumour-initiating cells (TICs) may be responsible for liver cancer initiation and recurrence. In this article, the authors show that a previously unidentified lncRNA, LncSox4, is highly expressed in liver cancer TICs and regulates TIC self-rene
Externí odkaz:
https://doaj.org/article/af4da882b3d24660a0f557ced5498b6f
Autor:
Xiu-Man Zhou, Wan-Qiong Li, Ya-Hong Wu, Lu Han, Xin-Guang Cao, Xuan-Ming Yang, Hong-Fei Wang, Wen-Shan Zhao, Wen-Jie Zhai, Yuan-Ming Qi, Yan-Feng Gao
Publikováno v:
Frontiers in Immunology, Vol 9 (2018)
TIGIT, an immune checkpoint molecule widely expressed on NK cells, activated T cells and Tregs, has been involved in delivering inhibitory signals through the interaction with PVR. The blockade of TIGIT/PVR interaction is a promising approach in canc
Externí odkaz:
https://doaj.org/article/1386dcba6fc24a179601f02e399bdfea
Publikováno v:
ICBK
Sequence pattern discovery is a key issue in multivariate time series analysis. Popular methods consist of three stages: feature extraction, feature clustering, and block sequence discovery. Both cross and temporal associations are obtained during th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9db2a056eb2d0229cff1fd8839c1c021
https://doi.org/10.1109/icbk.2018.00065
https://doi.org/10.1109/icbk.2018.00065
Publikováno v:
Journal of Central South University. 21:4157-4162
Low dielectric constant materials/Cu interconnects integration technology provides the direction as well as the challenges in the fabrication of integrated circuits (IC) wafers during copper electrochemical-mechanical polishing (ECMP). These challeng
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::df5a7e93cf0382557287ecedab36ff9c
https://doi.org/10.1007/s11771-014-2411-8
https://doi.org/10.1007/s11771-014-2411-8
Autor:
Wen Jie Zhai, Jin Hu Wang
Publikováno v:
Advanced Materials Research. 1017:423-428
The tribo-electrochemical performance of polycrystalline silicon was studied by Tafel polarization curves and electrochemical impedance spectroscopy (EIS), based on which the electrochemical mechanical planarization (ECMP) simulating test was done to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c6f3f565f0f8575e2947e9bda0fa0a33
https://doi.org/10.4028/www.scientific.net/amr.1017.423
https://doi.org/10.4028/www.scientific.net/amr.1017.423
Publikováno v:
Journal of Central South University. 21:2191-2201
The optimization of electrolytes and the material removal mechanisms for Cu electrochemical mechanical planarization (ECMP) at different pH values including 5-methyl-1H-benzotriazole (TTA), hydroxyethylidenediphosphoric acid (HEDP), and tribasic ammo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7a0fdeaa72db19cb6b76a1bca4a06241
https://doi.org/10.1007/s11771-014-2170-6
https://doi.org/10.1007/s11771-014-2170-6
Publikováno v:
Rare Metals. 39:1300-1306
Electrochemical mechanical polishing (ECMP) is a new and highly promising technology. A specific challenge for integrating Ru as barrier in Cu interconnect structures is the galvanic corrosion of Cu that occurs during ECMP. To mitigate the problem, t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ff707762415d4276e3ae1fe3c9587a0
https://doi.org/10.1007/s12598-014-0286-3
https://doi.org/10.1007/s12598-014-0286-3
Publikováno v:
Transactions of Nonferrous Metals Society of China. 23:2431-2438
According to the electrochemical analysis, the corrosion inhibition efficiency of 5-methyl-1H-benzotriazole ( m -BTA) is higher than that of benzotrizaole (BTA). The inhibition capability of the m -BTA passive film formed in hydroxyethylidenediphosph
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cc382936dafd0250b41aaf24df991f92
https://doi.org/10.1016/s1003-6326(13)62751-x
https://doi.org/10.1016/s1003-6326(13)62751-x
Autor:
Wen Jie Zhai, Jin Hu Wang
Publikováno v:
Applied Mechanics and Materials. 274:471-474
The influence of corrosion inhibitor BTA, chloride ion and anodic potential on the formation of copper passivation film was studied in the electrolyte of 18wt% HEDP by using Linear Sweep Voltammetry (LSV) and electrochemical impedance spectroscopy (E
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c38f5fd4a7d9c0c438319deff0452e2
https://doi.org/10.4028/www.scientific.net/amm.274.471
https://doi.org/10.4028/www.scientific.net/amm.274.471
Publikováno v:
Current Nanoscience. 8:676-679
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fffb13f7756f8a5d014bed49b81e0048
https://doi.org/10.2174/157341312802884463
https://doi.org/10.2174/157341312802884463