Zobrazeno 1 - 10
of 19
pro vyhledávání: '"Wen-Chiang Tu"'
Autor:
Wen-chiang Tu, 杜文強
103
From Kyoto Protocol in 1997 to Copenhagen Accord （COP15） in 2009, the carbon emissions reduction has become the focus around the world. Since the carbon trading system has begun to work, the carbon trading derivatives gradually developed
From Kyoto Protocol in 1997 to Copenhagen Accord （COP15） in 2009, the carbon emissions reduction has become the focus around the world. Since the carbon trading system has begun to work, the carbon trading derivatives gradually developed
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/83410942790936154727
Autor:
Ingemar Carlsson, Bogdan Swedek, Fritz Redeker, Katrina Mikhaylich, Tomohiko Kitajima, Brian J. Brown, Kun Xu, Sidney P. Huey, Shou-sung Chang, Wen-chiang Tu, Hassan G. Iravani, Shih-Haur Shen, Tzu-Yu Liu, Jason G. Fung
Publikováno v:
ECS Journal of Solid State Science and Technology. 5:P361-P367
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e0174a413c9ae4afc7e17c926f06c9f1
https://doi.org/10.1149/2.0371606jss
https://doi.org/10.1149/2.0371606jss
Publikováno v:
ECS Transactions. 27:533-538
Through-silicon via (TSV), an emerging technology for 3D IC manufacturing, involves fabrication of vertical vias through the wafers. The two methods commonly used involve "via-first" and "via-last" process flows. While the via-last approach appears t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5783ee65b39f2083a1bc81f518b90dec
https://doi.org/10.1149/1.3360670
https://doi.org/10.1149/1.3360670
Autor:
Max Gage, Yuchun Wang, Kun Xu, Sherry Xia, Lakshmanan Karuppiah, You Wang, Wen-Chiang Tu, Yufei Chen
Publikováno v:
ECS Transactions. 33:147-155
In this paper, we discuss CMP technology for Cu interconnects with a Co seed enhancement liner (SEL) and Cu with a Ru barrier. Typical forms of galvanic corrosion for each type of barrier are also reviewed. To meet CMP performance requirements, speci
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f451a4ae811485f9d33e38a449cc63b
https://doi.org/10.1149/1.3501041
https://doi.org/10.1149/1.3501041
Autor:
Hassan G. Iravani, May Yu, Sherry Xia, Kun Xu, Yuchun Wang, Bogdan Swedek, Lakshmanan Karuppiah, Yufei Chen, You Wang, Wen-Chiang Tu
Publikováno v:
ECS Transactions. 33:69-76
Because the gate height is critical to transistor performance, controlling gate height precisely and uniformly is the primary challenge for the replacement metal gate aluminum CMP process. A real-time profile control (RTPC) method was combined with a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b54940e078077565c34f323ad334c7bf
https://doi.org/10.1149/1.3489047
https://doi.org/10.1149/1.3489047
Autor:
Chenhao Ge, Feng Q. Liu, Yufei Chen, Mengqi Ye, Anja Rosenbusch, Kun Xu, Yuchun Wang, Alain Duboust, Sherry Xia, Wen-Chiang Tu, Lakshmanan Karuppiah
Publikováno v:
ECS Transactions. 19:73-79
Since the CMP process depends on chemical and mechanical effects, the interaction with the physical and chemical properties of the GST alloy play very important roles during the CMP process. In this paper, the impact of the CMP process on a soft GST
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3b534f5fdd396e62795920508a0db07
https://doi.org/10.1149/1.3123776
https://doi.org/10.1149/1.3123776
Publikováno v:
ECS Transactions. 19:83-90
The requirements for copper post-CMP cleaning include slurry particle removal, organic residue removal, metal contamination reduction, water mark elimination, copper corrosion prevention, and low-k surface change minimization. The difficulty in meeti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5ee130419199291efd72d92bacc4afa4
https://doi.org/10.1149/1.3123777
https://doi.org/10.1149/1.3123777
Publikováno v:
Journal of the American Ceramic Society. 79:417-424
A ceramic-matrix composite (CMC) that exhibits damage-tolerant behavior without weak interactions has been demonstrated. The concept relies on the heterogeneous distribution of fiber bundles within a porous matrix having homogeneous, fine porosity. I
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::87f3c378611e1a4ff8a1d62f23a04a1b
https://doi.org/10.1111/j.1151-2916.1996.tb08138.x
https://doi.org/10.1111/j.1151-2916.1996.tb08138.x
Autor:
Fred F. Lange, Wen-Chiang Tu
Publikováno v:
Journal of the American Ceramic Society. 78:3277-3282
The kinetics of infiltrating a solution precursor into Si3N4 powder compacts were studied using either water or an aqueous solution of Zr-nitrate and Y-nitrate that formed a crystalline Zr(Y)O2 (3 mol% Y2O3) solid solution during pyrolysis. When the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e93d41cfe2995de5b3982df8fa34ff32
https://doi.org/10.1111/j.1151-2916.1995.tb07965.x
https://doi.org/10.1111/j.1151-2916.1995.tb07965.x
Autor:
Fred F. Lange, Wen-Chiang Tu
Publikováno v:
Journal of the American Ceramic Society. 78:3283-3289
Si{sub 3}N{sub 4} powder compacts were infiltrated with liquid precursors which produce either Zr(Y)O{sub 2} (3 mol% Y{sub 2}O{sub 3}) solid solution or amorphous Si{sub 3}N{sub 4} after pyrolysis at relative low temperatures and without shrinkage. R
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3ebd8640f68a998aa7eac9ee9d829828
https://doi.org/10.1111/j.1151-2916.1995.tb07966.x
https://doi.org/10.1111/j.1151-2916.1995.tb07966.x