Zobrazeno 1 - 10
of 30
pro vyhledávání: '"Wen Hsien Chuang"'
Publikováno v:
2021 IEEE Physical Assurance and Inspection of Electronics (PAINE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::60f3e3c8476ad64ac4642b21599db785
https://doi.org/10.1109/paine54418.2021.9707713
https://doi.org/10.1109/paine54418.2021.9707713
Autor:
May Ling Oh, Shuai Zhao, Jennifer Huening, Joshua D Foster, Hyuk Ju Ryu, Swaran Kumar, Charles W Ladwig, Wen-hsien Chuang, Di Xu, Chia-Yi Chen, Lacey Badger, Tom Tong
Publikováno v:
International Symposium for Testing and Failure Analysis.
With the 3D stack-die technology, top die and base die are stacked together with micro-bumps for die-to-die interconnection and a through silicon via (TSV) for die-to-package connection. This technology provides tremendous flexibility as designers se
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2907685e1cf09efb127ac6e049b0138
https://doi.org/10.31399/asm.cp.istfa2020p0001
https://doi.org/10.31399/asm.cp.istfa2020p0001
Autor:
Prasoon Joshi, Tom Tong, Shuai Zhao, Di Xu, Wen-hsien Chuang, May Ling Oh, Hyuk Ju Ryu, Jennifer Huening
Publikováno v:
International Symposium for Testing and Failure Analysis.
On older semiconductor technology, electron-beam probing (EBP) for active voltage contrast and waveform on frontside metal lines was widely utilized. EBP is also being extended to include the well-known optical techniques such as signal mapping imagi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fc1ccdf32187938f61801c260c2f01f8
https://doi.org/10.31399/asm.cp.istfa2020p0100
https://doi.org/10.31399/asm.cp.istfa2020p0100
Autor:
Yunfei Wang, Prasoon Joshi, Wen-hsien Chuang, Di Xu, Ma Zhiyong, Steven R. Cook, Shuai Zhao, Piyush Vivek Deshpande, Jennifer Huening, Hyuk Ju Ryu, Xianghong Tom Tong
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5226f0f86b4b685beb093ab2814dc286
https://doi.org/10.31399/asm.tb.mfadr7.t91110323
https://doi.org/10.31399/asm.tb.mfadr7.t91110323
Publikováno v:
International Symposium for Testing and Failure Analysis.
This paper shows for the first time chip level electron beam probing on fully functional 10nm and 14nm node FinFET chips with sub-fin level resolution using techniques developed in house. Three novel electron beam probing techniques were developed an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fea869fb8d901e5eec9bd8285ef9da72
https://doi.org/10.31399/asm.cp.istfa2018p0345
https://doi.org/10.31399/asm.cp.istfa2018p0345
Autor:
Shang-Chih Lin, Chen Ying Chien, Wen-Hsien Chuang, Ching-Hong Tan, Ming-Chieh Chiang, Tsai-Hsiung Lu, Yuan-Ping Luh, Yeung-Jen Chen
Publikováno v:
Spine. 38:E775-E782
STUDY DESIGN The pretension of the Dynesys cord was varied to evaluate its effects on both tissue responses and screw-spacer behaviors by the finite-element method. OBJECTIVE This study aimed to provide detailed information about the motion-preservin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bd870d1168945bafe94d9aff0add3ab0
https://doi.org/10.1097/brs.0b013e318290fb2e
https://doi.org/10.1097/brs.0b013e318290fb2e
Autor:
Wen Hsien Chuang, Shang Chih Lin, Chih-Wei Wang, Jiun Ren Hwang, Shih Hao Chen, Yeung Jen Chen, Yi Jie Kuo
Publikováno v:
Spine. 38:E276-E285
ABSTRACT: Study Design. For lumbosacral nonlinear analysis, the characteristics and differences between the load- and range of motion-controlled methods (LCM and RCM) were compared using the numerical approach.Objective. This study aimed to discuss t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8c11cce53ef27a537c3de103d636feb5
https://doi.org/10.1097/brs.0b013e31828251f9
https://doi.org/10.1097/brs.0b013e31828251f9
Autor:
Wen Chi Tsai, Wen Hsien Chuang, Jiun Ren Hwang, Chih-Wei Wang, Shang Chih Lin, Yeung Jen Chen, Shih Hao Chen
Publikováno v:
Spine. 37:E1488-E1497
STUDY DESIGN The biomechanical effects of disc degeneration and hybrid fixation on the transition and adjacent segments were evaluated using a numerical approach. OBJECTIVE This study aimed to evaluate the rigidity-rising effects of the dehydrated di
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1b68fa291216759cad2500ae9de1fd5f
https://doi.org/10.1097/brs.0b013e31826cdd93
https://doi.org/10.1097/brs.0b013e31826cdd93
Publikováno v:
Journal of Micromechanics and Microengineering. 17:938-944
This paper describes a nano-scale tensile test to study the fatigue properties of LPCVD silicon nitride thin films using a novel electrostatic actuator design. Mechanical-amplifier devices made in silicon nitride thin films can apply controllable ten
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::83653a3238ac350f5c7c14a3a5f2afb6
https://doi.org/10.1088/0960-1317/17/5/013
https://doi.org/10.1088/0960-1317/17/5/013
Autor:
Tom Tong, Christopher S. Butler, Hyuk Ju Ryu, Wen-hsien Chuang, Martin von Haartman, Brett A. Buchea
Publikováno v:
International Symposium for Testing and Failure Analysis.
A novel fault isolation technique, electron beam induced resistance change (EBIRCh), allows for the direct stimulation and localization of eBeam current sensitive defects with resolution of approximately 100nm square, continuing a history of beam bas
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a6b73753c5a28dfa6a075bf94b5ede03
https://doi.org/10.31399/asm.cp.istfa2015p0382
https://doi.org/10.31399/asm.cp.istfa2015p0382