Zobrazeno 1 - 10
of 63
pro vyhledávání: '"Wen−an Loong"'
Publikováno v:
Japanese Journal of Applied Physics. 46:105-110
The applications of a high-transmittance embedded layer (HTEL) (T=15–35%) in an attenuated phase-shifting mask were studied by simulation with the aid of Taguchi design of experiment. A modified transmittance control mask with HTEL was proven to be
Publikováno v:
Japanese Journal of Applied Physics. 45:6216-6224
Simulations for the optimization of the mask error enhancement factor (MEEF) by using Taguchi's design of experiment (DOE) method in both dry and immersion ArF lithography have been demonstrated here. By DOE, MEEF has been successfully reduced, and t
Autor:
Kwei-Tin Yeh, Wen-an Loong
Publikováno v:
Japanese Journal of Applied Physics. 45:2481-2496
In general, better resolution and lower mask error enhancement factor (MEEF) are obtained when a higher numerical aperture (NA) is used. However, simulations in this study show that, if Y-polarized light and off-axis illuminations were used, higher N
Publikováno v:
Japanese Journal of Applied Physics. 45:1566-1569
Because the surface roughness of a thin film will cause light scattering, the reflectance (R) and transmittance (T) measured using a UV/visible (vis) spectrometer become lower than the actual values. The deviation becomes larger with increasing rough
Autor:
Wen-an Loong, Cheng-ming Lin
Publikováno v:
Japanese Journal of Applied Physics. 41:4037-4041
When the compositions of Al2O3, SiO2 and other oxides were increased, refractive index (n) appeared to increase and extinction coefficient (k) to decrease in AlSixOy. The study of the correlation among sputtering conditions, chemical compositions and
Autor:
Wen-an Loong, Cheng-ming Lin
Publikováno v:
Microelectronic Engineering. :41-48
In contrast to the normal transmittance (T
Publikováno v:
Microelectronic Engineering. :481-487
We reported that the optical and physical properties of TiSi x N y thin films formed by sputtering are suitable to be used as an embedded layer in 193 nm. The TiSi x N y films were deposited under DC power of Ti target 170–220 W, RF power of Si tar
Autor:
Wen-an Loong, Cheng-ming Lin
Publikováno v:
Microelectronic Engineering. 53:133-136
AlSi"xN"y (x~0.31, y~0.45) thin film as a new embedded material for AttPSM in 193 nm lithography was presented. With the good controlling of plasma sputtering of Al (100~130 W) and Si (20~50 W) under Ar (75 sccm), and nitrogen (2.5~5 sccm), AlSi"xN"y
Autor:
Wen-an Loong, Cheng-ming Lin
Publikováno v:
Microelectronic Engineering. 46:93-96
TiSi"xN"y and TiSi"xO"yN"z were presented as new embedded materials for APSM in 193 nm lithography. TiSi"xN"y films were formed by plasma sputtering of Ti (180~230 W) and Si (60~80 W) under Ar (50 sccm) and nitrogen (4~6 sccm). For required phase shi
Publikováno v:
Microelectronic Engineering. :125-128
TiSi x O y as an absorptive shifter (embedded layer) for attenuated phase-shifting mask (APSM) in 248 nm wavelength is presented. TiSi x O y thin film was formed by plasma sputtering of Ti (25∼55 W) and Si (200∼250 W) under Ar (30 sccm) and oxyge