Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Weixu Zhong"'
Publikováno v:
Ionics. 29:917-930
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::131d92b272d97f038cf9b1ad96513668
https://doi.org/10.1007/s11581-022-04866-z
https://doi.org/10.1007/s11581-022-04866-z
Publikováno v:
ChemistrySelect. 7
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::96f03f037a1c6320aca560b7c3904ae5
https://doi.org/10.1002/slct.202202086
https://doi.org/10.1002/slct.202202086
Publikováno v:
New Journal of Chemistry. 45:10541-10548
The copper current collector is an essential part of lithium-ion batteries (LIBs) that can greatly affect safety, stability, and energy density and it is thus of great importance to develop a strategy for improving copper (Cu) current collectors. Her
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c7f222b1669a5952a60316187a495b57
https://doi.org/10.1039/d1nj01483h
https://doi.org/10.1039/d1nj01483h
Publikováno v:
SSRN Electronic Journal.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c2c768c612351571bd6864b895959a69
https://doi.org/10.2139/ssrn.4095745
https://doi.org/10.2139/ssrn.4095745
Publikováno v:
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
Intermetallic compounds (IMCs) that grow on the interface between the solder alloy and its bonding pads play a crucial role in the reliability of solder joints. It has been identified that the cracking around the IMC layer is the primary failure mode
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7e14275d74008e9b78d0aced31ca7482
https://doi.org/10.1109/icept.2010.5582669
https://doi.org/10.1109/icept.2010.5582669