Zobrazeno 1 - 10
of 53
pro vyhledávání: '"Weisheng Xia"'
Publikováno v:
Ecotoxicology and Environmental Safety, Vol 272, Iss , Pp 116038- (2024)
Liming has been widely taken to remediate Cd-contaminated acidic paddy soils, whereas liming mode involving in the relevant optimal soil pH, model and efficacies remain unclear. Both soil and field liming experiments were conducted to improve liming
Externí odkaz:
https://doaj.org/article/14ea4f5b10674db48c40dcffcb6ba0dc
Publikováno v:
Metals, Vol 11, Iss 9, p 1410 (2021)
Laser powder bed fusion (LPBF) technology is beneficial for the fabrication of thermal conductive materials, integrating with the predesigned structure, which shows a great potential for high heat dissipation applications. Here, a Cu–Cr–Zr alloy
Externí odkaz:
https://doaj.org/article/9c387b123ff34ed191aa60225eab3c7d
Publikováno v:
International Conference on Optical and Photonic Engineering (icOPEN 2022).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::82affd0691f4d850341f15182e065f75
https://doi.org/10.1117/12.2666683
https://doi.org/10.1117/12.2666683
Publikováno v:
Soldering & Surface Mount Technology, 2014, Vol. 26, Issue 3, pp. 162-171.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/SSMT-11-2013-0034
Publikováno v:
Metallurgical and Materials Transactions A. 50:1936-1942
Cu-Ni-Mn alloy coatings and their associated composite coatings reinforced with tungsten-carbide (WC) particles were deposited onto a steel substrate using the manual oxy-acetylene weld hardfacing method. The sliding wear behaviors in air at 350 °C
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::25fa1b77587610086a19e02901fcb6ad
https://doi.org/10.1007/s11661-019-05126-y
https://doi.org/10.1007/s11661-019-05126-y
Publikováno v:
Journal of Physics: Conference Series. 2174:012063
We proposed a cold capacitively-coupled-plasma jet method to deposit the seed layer in the inner wall of Through-silicon-vias (TSVs) directly. Comparison experiments were carried out to optimize the process parameters. The testing results were discus
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e50b7dfe2f177142afdb8dd4687b8f9f
https://doi.org/10.1088/1742-6596/2174/1/012063
https://doi.org/10.1088/1742-6596/2174/1/012063
Publikováno v:
Optik. 154:33-40
A facile, simple to synthesis uniform and monodisperse, well size distribution of silver nanoparticle with 20–30 nm was reported. The silver nanoparticles were successfully synthesis by liquid phase method of EG (Ethylene glycol) in the presence of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8d9348dd473c6ce6c6a90d9f66c47764
https://doi.org/10.1016/j.ijleo.2017.10.024
https://doi.org/10.1016/j.ijleo.2017.10.024
Publikováno v:
Soldering & Surface Mount Technology. 29:156-163
Purpose The purpose of this paper is to study the microstructure and mechanical behaviour of smaller microbumps for high density solder interconnects. Design/methodology/approach The microstructure was analyzed by scanning electron microscopy and ele
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4facb1d0437a1ca5fadfee43d3d54e00
https://doi.org/10.1108/ssmt-04-2016-0009
https://doi.org/10.1108/ssmt-04-2016-0009
Publikováno v:
Metallurgical and Materials Transactions A. 48:3017-3026
The Cu-Ni-Mn alloy-based hardfacing coatings reinforced by WC particles (WC/Cu-Ni-Mn) were deposited on a steel substrate by a manual oxy-acetylene weld hardfacing method. A sound interfacial junction was formed between the WC particles and the Cu-Ni
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2485672d42bece724c1e790a44ddffeb
https://doi.org/10.1007/s11661-017-4072-3
https://doi.org/10.1007/s11661-017-4072-3
Autor:
Ming Xiao, Walid Madhat Munief, Fengshun Wu, Rainer Lilischkis, Tobias Oberbillig, Weisheng Xia, Monika Saumer
Publikováno v:
Soldering & Surface Mount Technology. 28:74-83
Purpose The purpose of this paper is to fabricate a new Cu-Sn-Ni-Cu interconnection microstructure for electromigration studies in 3D integration. Design/methodology/approach The Cu-Sn-Ni-Cu interconnection microstructure is fabricated by a three-mas
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c77502d33a1caec38f0eef13ebeb0302
https://doi.org/10.1108/ssmt-10-2015-0031
https://doi.org/10.1108/ssmt-10-2015-0031