Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Weishan Lv"'
Publikováno v:
Microsystems & Nanoengineering, Vol 10, Iss 1, Pp 1-12 (2024)
Abstract The projected speckle-based three-dimensional digital image correlation method (3D-DIC) is being increasingly used in the reliability measurement of microelectronic packaging structures because of its noninvasive nature, high precision, and
Externí odkaz:
https://doaj.org/article/73ad9a2f01734c85b806cc9cd34dc047
Publikováno v:
Journal of Materials Research and Technology, Vol 27, Iss , Pp 2490-2507 (2023)
Due to the excellent electrothermal properties, outstanding resistance to electromigration and cost-effectiveness, Cu nanoparticles are considered as a promising bonding material for high-power device. However, few studies have analyzed the coalescen
Externí odkaz:
https://doaj.org/article/2972c28bac3d479693faec767d3d56ed
Publikováno v:
Results in Physics, Vol 57, Iss , Pp 107411- (2024)
Cu and Ag nanoparticles are widely encouraged to be regarded as the die-attach material for power device packaging due to the small size effects and excellent physical properties. However, Cu nanoparticles are prone to oxidation during the sintering
Externí odkaz:
https://doaj.org/article/e3580c5e90e8493fbc4ad9185f4160c5
Publikováno v:
Micromachines, Vol 13, Iss 2, p 172 (2022)
This paper presents the design and optimization of a novel MEMS tuning fork gyroscope microstructure. In order to improve the mechanical sensitivity of the gyroscope, much research has been carried out in areas such as mode matching, improving the qu
Externí odkaz:
https://doaj.org/article/946dd2d11272433688bec61b2581c700
Publikováno v:
IEEE Transactions on Electron Devices. 70:3202-3207
Publikováno v:
IEEE Transactions on Electron Devices. 70:702-707
Autor:
Qian Chen, Chuanguo Xiong, Weishan Lv, Ben Shen, Baoshan Zeng, Jinming Li, Chenzefang Feng, Zhou Hu, Fulong Zhu
Publikováno v:
Transportation Research Record: Journal of the Transportation Research Board. 2676:112-123
As tunnel construction proceeds ever more rapidly, the efficiency of seepage detection by engineers with expert knowledge is facing unprecedented challenges. Moreover, it suffers from strong subjectivity. In recent years, deep learning, as an algorit
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Publikováno v:
Diamond and Related Materials. 133:109710
Publikováno v:
Nanotechnology. 34:165701
Nano-silver has the characteristics of low-temperature sintering and high-temperature service, which can reduce the thermal stress in the packaging process. Because of the high melting point and good high-temperature mechanical properties, silver is