Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Weipeng Ren"'
Publikováno v:
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
3D chip on board (CoB) packaging is a promising technique for the 3D IC integration. However, it is facing some difficulties such as voids and high internal stress in the potting process. In this paper, a low void ratio and low stress potting technol
Publikováno v:
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
The need for 3D stack package is driven by rapidly developed integrated circuit and semiconductor industry. A 3D stack package with anodic alumina substrate was created for integration of multifunctional microsystems. The penetrating anodization of a
Publikováno v:
Physical Chemistry Chemical Physics. 17:28658-28665
Nitrogen-doped SiC nanowires (N-doped SiC NWs) with a nitrogen content from 0.975 wt% to 2.265 wt% have been synthesized via a one-step chemical vapor reaction (CVR), where melamine served as both the carbon and nitrogen source. Interestingly, the mo