Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Weifeng Long"'
Publikováno v:
Sensors, Vol 24, Iss 15, p 4899 (2024)
A Wireless Body Area Network (WBAN), introduced into the healthcare sector to improve patient care and enhance the efficiency of medical services, also brings the risk of the leakage of patients’ privacy. Therefore, maintaining the communication se
Externí odkaz:
https://doaj.org/article/ee85cad6a16c4cf5bc7c656f1922b7b7
Publikováno v:
Materials, Vol 15, Iss 21, p 7841 (2022)
Nanosecond laser cleaning effectively removes oxide film and dirt from the surface of aluminum body parts for rail transit, as well as improving surface properties. The effect of laser cleaning on the quality of weld was studied in detail for differe
Externí odkaz:
https://doaj.org/article/d2e1c28833bc45eaaee4be7cf8e302d4
Publikováno v:
Materials, Vol 11, Iss 1, p 84 (2018)
In order to accelerate the growth of interfacial intermetallic compound (IMC) layers in a soldering structure, Cu/SAC305/Cu was first ultrasonically spot soldered and then subjected to isothermal aging. Relatively short vibration times, i.e., 400 ms
Externí odkaz:
https://doaj.org/article/d5635ce528d74602905b80b27a4e6d64
Publikováno v:
Journal of Alloys and Compounds. 802:345-354
The reactive wetting of AgCuTi filler metal over a TC4 substrate was conducted using real-time in situ hot stage microscopy. In addition to the commonly observed bulk liquid, a rapidly spreading precursor film was observed. Both the precursor film an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::425efab42b417b75bc0b8c807459b604
https://doi.org/10.1016/j.jallcom.2019.06.168
https://doi.org/10.1016/j.jallcom.2019.06.168
Publikováno v:
Journal of Materials Science: Materials in Electronics. 29:13914-13924
Wetting kinetics of Sn-35Bi-1Ag solder on different substrates were investigated at elevated temperatures, within the range of 473–553 K. The randomly polished Cu substrate, Ni substrate and electroless nickel plating of Cu were chosen as the subst
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::594b74482b2aa18bf23bb4b9801402ae
https://doi.org/10.1007/s10854-018-9524-z
https://doi.org/10.1007/s10854-018-9524-z
Publikováno v:
Materials, Vol 11, Iss 1, p 84 (2018)
Materials; Volume 11; Issue 1; Pages: 84
Materials
Materials; Volume 11; Issue 1; Pages: 84
Materials
In order to accelerate the growth of interfacial intermetallic compound (IMC) layers in a soldering structure, Cu/SAC305/Cu was first ultrasonically spot soldered and then subjected to isothermal aging. Relatively short vibration times, i.e., 400 ms
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0c9091d18deaeed67938bea8bf974a54
https://doi.org/10.3390/ma11010084
https://doi.org/10.3390/ma11010084
Autor:
Long, Weifeng1,2 (AUTHOR) 460143769@gznu.edu.cn, Deng, Lunzhi2 (AUTHOR) 19010060164@gznu.edu.cn, Zeng, Jiwen1 (AUTHOR), Gao, Yan2 (AUTHOR) 232200061298@gznu.edu.cn, Lu, Tianxiu2 (AUTHOR)
Publikováno v:
Sensors (14248220). Aug2024, Vol. 24 Issue 15, p4899. 29p.
Autor:
Zhang, Yuelai1 (AUTHOR), Yao, Qi1 (AUTHOR), Long, Weifeng1 (AUTHOR), Wang, Chunming2 (AUTHOR), Lin, Ji2 (AUTHOR), Liu, Zehui2 (AUTHOR) lzh912430891@163.com
Publikováno v:
Materials (1996-1944). Nov2022, Vol. 15 Issue 21, p7841. 16p.
Publikováno v:
Electronics (2079-9292); Apr2024, Vol. 13 Issue 8, p1449, 29p
Publikováno v:
Materials (1996-1944). Jan2018, Vol. 11 Issue 1, p84. 11p. 5 Black and White Photographs, 1 Diagram, 2 Graphs.