Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Wei-na Hao"'
Publikováno v:
Defence Technology, Vol 17, Iss 4, Pp 1135-1142 (2021)
In order to improve the infrared detection and discrimination ability of the smart munition to the dynamic armor target under the complex background, the multi-line array infrared detection system is established based on the combination of the single
Externí odkaz:
https://doaj.org/article/dff1ded1bf62426b852164c935927599
Publikováno v:
Applied Mechanics and Materials. :1244-1248
This paper presents a new cycloid permanent magnet gear(PM gear) based on Halbach array, which has the advantages such as extreme torque density and a very high gearing ratio. And the Halbach array can produce one-sided filed that will increase the m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c2909e03be6342251cee0efa6292fac2
https://doi.org/10.4028/www.scientific.net/amm.271-272.1244
https://doi.org/10.4028/www.scientific.net/amm.271-272.1244
Publikováno v:
Advanced Materials Research. :77-84
A viscoplastic constitutive model with void damage is developed to analyze the macroscopic mechanical response and damage mechanism of lead-free solder alloy in CBGA packaging under cyclic thermal loading. The constitutive model is implemented into A
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ef2a23b097df3dca39548fa0f836fa4c
https://doi.org/10.4028/www.scientific.net/amr.44-46.77
https://doi.org/10.4028/www.scientific.net/amr.44-46.77
Publikováno v:
Materials Science Forum. :432-435
The utilization of ceramics materials for structural components has been widespread because of their excellent properties. But the ceramic components require high precision and integrity of surface. The grinding is the main productive technique for f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ab32b1fcc0ce808936cdc18208a087e
https://doi.org/10.4028/www.scientific.net/msf.532-533.432
https://doi.org/10.4028/www.scientific.net/msf.532-533.432
