Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Wei-min Long"'
Publikováno v:
Journal of Materials Research and Technology, Vol 15, Iss , Pp 3974-3982 (2021)
In this paper, the intermetallic compound (IMC) growth behaviors of Sn/Cu and Sn–0.6SiC/Cu solder under isothermal aging (50, 100, 150, 200 and 250 h) and thermal cycling (300, 600, 900, 1200 and 1500 cycles) were studied. The results manifested th
Externí odkaz:
https://doaj.org/article/5d8e140cc2ec45098026ae787ae75e0c
Publikováno v:
Materials & Design, Vol 215, Iss , Pp 110439- (2022)
During the past decades, series of lead-free solders have been developed rapidly, and are considered as the attractive interconnection materials replacing traditional Sn-Pb solders in electronic industry. In this paper, the interfacial reaction, micr
Externí odkaz:
https://doaj.org/article/de556c3bcfb74354abdb403a92daa6fb
Autor:
Nan Jiang, Liang Zhang, Zhi-Quan Liu, Lei Sun, Wei-Min Long, Peng He, Ming-Yue Xiong, Meng Zhao
Publikováno v:
Science and Technology of Advanced Materials, Vol 20, Iss 1, Pp 876-901 (2019)
Electronic products are evolving towards miniaturization, high integration, and multi-function, which undoubtedly puts forward higher requirements for the reliability of solder joints in electronic packaging. Approximately 70% of failure in electroni
Externí odkaz:
https://doaj.org/article/67223ea7164e4f1e83a427074f4399fd
Publikováno v:
MATERIALS TRANSACTIONS. 63:1375-1379
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::30b68794f1eb9a329dddf391b7fc731b
https://doi.org/10.2320/matertrans.mt-m2022061
https://doi.org/10.2320/matertrans.mt-m2022061
Publikováno v:
Journal of Materials Science: Materials in Electronics. 33:7923-7932
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::97ab9b53248a576353cfdb108fe9c5cc
https://doi.org/10.1007/s10854-022-07941-3
https://doi.org/10.1007/s10854-022-07941-3
Publikováno v:
Journal of Materials Science: Materials in Electronics. 34
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bd68a626ba2992da9a837ba8c8f08e47
https://doi.org/10.1007/s10854-022-09609-4
https://doi.org/10.1007/s10854-022-09609-4
Publikováno v:
Journal of Materials Science: Materials in Electronics. 32:16970-16978
In this work, Cu/Sn58Bi/Cu and Cu/Sn58Bi-0.05GNSs/Cu solder joints were prepared using transient liquid phase (TLP) bonding technology. The effects of graphene nanosheets (GNSs) on the interfacial reaction in Cu/Sn58Bi/Cu TLP joints have been investi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f3a63699619b0fbdf50bfdff50ecc058
https://doi.org/10.1007/s10854-021-06261-2
https://doi.org/10.1007/s10854-021-06261-2
Publikováno v:
Journal of Materials Science: Materials in Electronics. 32:3341-3351
In this paper, 0.1 wt% Ti particles (2–5 μm) was incorporated into the Sn58Bi solder to improve the properties of Sn58Bi/Cu solder joint. The interface reaction and growth kinetics of the Sn–Cu IMC at the solder/Cu interface during solid–liqui
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3fb4e20e36f9e21c3d75c72cce025b03
https://doi.org/10.1007/s10854-020-05082-z
https://doi.org/10.1007/s10854-020-05082-z
Publikováno v:
Key Engineering Materials. 871:254-263
The first-principles calculations by CASTEP program based on the density functional theory is applied to calculate the cohesive energy, enthalpy of formation, elastic constant, density of states and Mulliken population of Ag3Sn、AgZn3 and Ag5Zn8. Fu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::634b2973ddc72f6ca5c37dbf94ea15c8
https://doi.org/10.4028/www.scientific.net/kem.871.254
https://doi.org/10.4028/www.scientific.net/kem.871.254
Publikováno v:
Coatings; Volume 12; Issue 3; Pages: 342
A Ce-containing Ni-based tungsten carbide layer was prepared on the surface of Q345 steel by plasma arc cladding technology. The effect of CeO2 additions on the microstructure and properties of the Ni-based tungsten carbide cladding layer was investi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d1ad377daabb2044256ec9417bb51f95