Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Wei-how Chen"'
Autor:
Wei-How Chen, 陳威豪
103
more and more technological advances, people''s desire demand has slowly improved, integrated circuit design to meet future life functions, slowly at 40 nm to 16 nm, due to the now three-dimensional stacked integrated circuits technology ope
more and more technological advances, people''s desire demand has slowly improved, integrated circuit design to meet future life functions, slowly at 40 nm to 16 nm, due to the now three-dimensional stacked integrated circuits technology ope
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/20842608102019395170
Autor:
Wei-How Chen, 陳偉豪
91
The transportation-related construction plays a significant role in a country’s overall development. With Taiwan’s mountainous terrain, almost every railroad, highway, or Mass Rapid Transit (MRT) network requires the construction of bridg
The transportation-related construction plays a significant role in a country’s overall development. With Taiwan’s mountainous terrain, almost every railroad, highway, or Mass Rapid Transit (MRT) network requires the construction of bridg
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/12182459592636472018
Autor:
Che-Wei Wu, Han-Wen Hu, Wei-how Chen, Meng-Fan Chang, Yi-Lun Lu, Jui-Yu Hung, Shin-Jang Shen, Yan-Bing Jhang, Yih-Shan Yang
Publikováno v:
2016 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b3ff6fdf10e2246a1531d5d245970c2e
https://doi.org/10.1109/edssc.2016.7785278
https://doi.org/10.1109/edssc.2016.7785278
Publikováno v:
Microelectronic Engineering. 87:2146-2157
This study investigates the reliability of the assembly of chips and flex substrates using the thermosonic flip-chip bonding process with non-conductive paste (NCP). The high-temperature storage (HTS) test, the temperature cycling test (TCT), the pre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0c82aeb2ad609ee4254bd87fd4aaea76
https://doi.org/10.1016/j.mee.2010.01.017
https://doi.org/10.1016/j.mee.2010.01.017
Publikováno v:
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
The purpose of this study is to verify the reliability of chips bonded on flex substrates using thermosonic flip-chip bonding process with a non-conductive paste (NCP). High temperature storage (HTS) test, temperature cycling test (TCT), pressure coo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3d7b1f7b47719f63c26fc100ede1e9bd
https://doi.org/10.1109/icept.2009.5270654
https://doi.org/10.1109/icept.2009.5270654
Publikováno v:
2009 International Conference on Electronic Packaging Technology & High Density Packaging; 2009, p725-732, 8p