Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Wei-Ran Kong"'
Publikováno v:
IEEE Transactions on Electron Devices. 61:2350-2356
A highly reliable 2-bits/cell split-gate flash memory cell in a novel program-disturbs immune array architecture is fabricated and demonstrated. Using a novel metal interconnect technique, a new virtual-ground array architecture is realized to greatl
Autor:
Jun He, Ching-Dong Wang, Yaoqi Dong, Wei-Ran Kong, Jun Wang, Xiaohua Cheng, Zhenhai Sun, Liu-Jiang Yu, Rui Li
Publikováno v:
Microelectronic Engineering. 88:3270-3274
The removal of silicide-block-film is crucial for device stability, reliability and subsequent silicide formation. In this paper, various silicide block etch processes, i.e. dry and wet etch, were studied and compared. Possible plasma charging damage
Autor:
Liu-Jiang Yu, Ching-Dong Wang, Chun-Qi Geng, Rui Li, Wei-Ran Kong, Jiang Ning, Kevin Huang, Kai Tao
Publikováno v:
IEEE Electron Device Letters. 28:360-362
Mechanical stress-enhanced plasma process-induced damage (PPID) in 0.13-mum pMOSFET was investigated. The PPID, which was initially charged neutral, became positively charged during hydrogen annealing, thus, changing the PMOS threshold voltage (Vth).
Autor:
Rui Li, Wei-Ran Kong, Kai Tao, Liu-Jiang Yu, Kevin Huang, Jiang Ning, Chun-Qi Geng, Ching-Dong Wang
Publikováno v:
IEEE Electron Device Letters; May2007, Vol. 28 Issue 5, p360-362, 3p, 5 Graphs