Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Wei-Lun Jen"'
Autor:
Sriram Srinivasan, Ashish Dhall, Ram S. Viswanath, Ravi Mahajan, Kemal Aygun, Sujit Sharan, Zhi-Guo Qian, Wei-Lun Jen
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:1952-1962
This article provides an overview of the embedded multidie interconnect bridge (EMIB) multichip packaging (MCP) technology. EMIB is a unique packaging paradigm that provides very high-density interconnects (currently in the range of 500–1000 I/O/mm
Publikováno v:
Annual Review of Materials Research. 39:155-180
The term nanoimprint lithography (NIL) describes a number of processes used to form nanoscale structures by molding or embossing. Step and flash imprint lithography (S-FIL, a trademark of Molecular Imprints, Inc.) is a variant of NIL that can be perf
Autor:
C. Grant Willson, Timothy Rochelle, Wei-Lun Jen, Anja Vanleenhove, Roel Gronheid, Jacob R. Adams, Jeff R. Strahan, Colin C. Neikirk
Publikováno v:
Advances in Resist Materials and Processing Technology XXVI.
In an effort to improve upon the sensitivity of commercial non-chemically amplified e-beam resists, four polyacrylates functionalized with α-CF3 and/or CH 2 CF 3 alkoxy substituents were studied. The α-CF 3 substituent is known to increase backbone
Autor:
Ken Sotoodeh, Wei-Lun Jen, Jordan Owens, Brook Chao, Bruce Wilks, D. Hale McMichael, Frank L. Palmieri, Ronald Carpio, C. Grant Willson, Ed Labelle, Joseph Pham, Jeff Wetzel, Rich Berger
Publikováno v:
SPIE Proceedings.
Step and Flash Imprint Lithography (S-FIL ® ) in conjunction with Sacrificial Imprint Materials (SIM) shows promise as a cost effective solution to patterning sub 45 nm features and is capable of simultaneously patterning two levels of interconnect
Autor:
Frank L. Palmieri, Jordan Owens, Lorenz Nedelmann, Brook Chao, Mathias Irmscher, Ron Carpio, Joerg Butschke, Marcus Pritschow, Holger Sailer, Christian Reuter, Ken Sotoodeh, Grant Willson, Corinna Koepernik, Bruce Wilks, Jeff Wetzel, Wei Lun Jen
Publikováno v:
SPIE Proceedings.
A dual damascene template fabrication process has been developed, which enables the structuring of high-resolution, high-aspect pillars on top of lines. Based on this technology templates with three different designs have been fabricated and characte
Autor:
C. Grant Willson, Tsutomu Shimokawa, Colin C. Neikirk, Koichi Fujiwara, Koji Ito, William H. Heath, Isao Nishimura, Saul Lee, Wei Lun Jen, Kazuya Matsumoto
Publikováno v:
Advances in Resist Materials and Processing Technology XXV.
Acid diffusion during the post-exposure bake of chemically amplified resists (CARs) is a major contributing factor to line width roughness (LWR) and resolution limits at the 32 nm node and beyond. To overcome these limitations, non-CAR materials are
Autor:
Wei-Lun Jen, Frank Palmieri, Brook Chao, Michael Lin, Jianjun Hao, Jordan Owens, Ken Sotoodeh, Robin Cheung, C. Grant Willson
Publikováno v:
SPIE Proceedings.
Autor:
Anja Vanleenhove, Jacob R. Adams, Timothy Rochelle, Colin C. Neikirk, Roel Gronheid, Jeffrey R. Strahan, C. Grant Willson, Wei-Lun Jen
Publikováno v:
Journal of Micro/Nanolithography, MEMS, and MOEMS. 8:043011
In an effort to improve on the sensitivity of commercial nonchemically amplified e-beam resists, four polyacrylates functionalized with -CF3 and/or CH2CF3 alkoxy substituents were studied. The -CF3 substituent is known to increase backbone-scission e
Publikováno v:
Annual Review of Materials Research; 2009, Vol. 39 Issue 1, p155-180, 26p
Autor:
Jeffrey R. Strahan, Jacob R. Adams, Wei-Lun Jen, Anja Vanleenhove, Colin C. Neikirk, Timothy Rochelle, Roel Gronheid, C. Grant Willson
Publikováno v:
Journal of Micro/Nanolithography, MEMS & MOEMS; Oct2009, Vol. 8 Issue 4, p043011-043011-8, 1p