Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Wei-Kuo Han"'
Publikováno v:
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
A new SSMT (Sim Surface Mount Technology) IPM (Intelligent Power Module) is a fully optimized inverter module for electrically assisted bike’s motor drive applications. The size of the module is smaller than that of conventional TO type while keepi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e5e95317a160fefd99eda9e1c8d46ce2
https://doi.org/10.1109/impact50485.2020.9268540
https://doi.org/10.1109/impact50485.2020.9268540
Autor:
Wei-Kuo Han, H.H. Lin, June-Chien Chang, Y. T. Lin, Kuo-Shu Kao, Chih-Ming Tzeng, T. C. Chang
Publikováno v:
2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD).
This paper introduces a novel all-in-one digital-analog heterogeneous integrated intelligent power module (IPM) which is composed of Si MOSFETs, Gate Driver and Micro Controller Unit (MCU). This novel all-in-one module realized by heterogeneous integ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bae8b93ff0f59414a6c96a4997ac9f32
https://doi.org/10.1109/ispsd.2019.8757581
https://doi.org/10.1109/ispsd.2019.8757581
Autor:
S.F. Hsu, K. Anai, T. Sakaue, K.H. Cheng, H.H. Lin, J. L. Jo, S. Yamauchi, Su-Yu Fun, C.M. Tseng, Wei-Kuo Han, H.W. Cheng, J. Y. Chang, T. C. Chang
Publikováno v:
2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
In Recent year, the traditional Si and wide band-gap power semiconductor devices, particularly Si MOSFET, Si IGBT, SiC MOSFET and GaN E-HEMT have gained considerable attention in several industrial applications such as the hybrid electric vehicle, th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4b63710b2acaa2b9b73e549fa0281981
https://doi.org/10.1109/impact.2018.8625823
https://doi.org/10.1109/impact.2018.8625823
Autor:
C K Liao, Rong-Chang Fang, Jack Tu, Yu-Lin Chao, Wei-Kuo Han, Amy Lin, Shu-Jung Yang, M H Yen, Chun-Kai Liu
Publikováno v:
2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Power electronics systems trend to decrease size, increase switching frequency and voltage ratings. This has resulted in higher power dissipation dnesities of IGBT modules and higher junction temperature of IGBT devices. Thermal management becomes an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::30916d873403e8b43ff5364574d3b183
https://doi.org/10.1109/impact.2014.7048421
https://doi.org/10.1109/impact.2014.7048421
Publikováno v:
2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Approximate 70% of the energy generated by the combustion of fuel in IC engine cannot be converted into mechanical energy, but disperses to the environment as waste heat. Reduction of energy consumption and curb of CO 2 emissions of automotive become
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::db83b4776482b44cf9e0ca9892b5d6c7
https://doi.org/10.1109/impact.2014.7048422
https://doi.org/10.1109/impact.2014.7048422
Autor:
Wei Kuo Han, 韓偉國
91
The present heat sink of most heat sink are rectangular shapes. Fins become parallel or irradiative arrays, extruded from the surface of substrate. The flow of forced convective fan is from the top surface coming, no flow blow out from hub of
The present heat sink of most heat sink are rectangular shapes. Fins become parallel or irradiative arrays, extruded from the surface of substrate. The flow of forced convective fan is from the top surface coming, no flow blow out from hub of
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/57341791499777216122
Autor:
Ming-Daw Chen, Wei-kuo Han
Publikováno v:
The Journal of the Acoustical Society of America. 133:3211
A speaker device including a transparent speaker and a light source module is provided. The transparent speaker is thin, soft, and has a low driving voltage. Light is emitted from a front side of the speaker panel, and transmitted in the same directi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::38e894701305bda74d5d7a388778ac63
https://doi.org/10.1121/1.4803752
https://doi.org/10.1121/1.4803752
Autor:
Chang, Jing-Yao, Su-Yu Fun, Leu, Fang-Jun, Kao, Kuo-Shu, Chih-Ming Tzeng, Wei-Kuo Han, Chang, Tao-Chih
Publikováno v:
2014 International Conference on Electronics Packaging (ICEP); 2014, p96-100, 5p