Zobrazeno 1 - 10
of 26
pro vyhledávání: '"Wei-Hao Chi"'
Publikováno v:
2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ef73a917d25730479e9da6ea6a6188c1
https://doi.org/10.1109/impact53160.2021.9696969
https://doi.org/10.1109/impact53160.2021.9696969
Publikováno v:
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
In the paper, we introduce thermal, electrical and long term reliability characteristic of insulated metal substrate (IMS) and comparing to the conventional DBC+Baseplate structure. Thermal performance is determined by junction to case thermal resist
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3ee5b6b5fbac6403d7e5a1d3e1e2441b
https://doi.org/10.1109/impact50485.2020.9268538
https://doi.org/10.1109/impact50485.2020.9268538
Publikováno v:
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Power modules are widely used to control and convert electrical power system, such as industrial, railway, and even electric vehicle applications. Higher operation temperature and high current density requests of power devices make it is more and mor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fc46b57a5095b085cc613916261486c0
https://doi.org/10.1109/impact50485.2020.9268539
https://doi.org/10.1109/impact50485.2020.9268539
Publikováno v:
2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Power module reliability becomes more and more important than before, especially in the next generation power device. Electric vehicle applications and high temperature operation need better lifetime and environmental resistance. The encapsulated mat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::758c51afb3525c4dfb0eee4459604dbb
https://doi.org/10.1109/impact47228.2019.9024973
https://doi.org/10.1109/impact47228.2019.9024973
Publikováno v:
2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Power electronic modules, based on a range of semiconductor technologies are widely used to control and convert electrical power system, such as industrial, railway, and even electric vehicle applications. The most common technology of a die-level in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a85eb74614a28cb3907b87f3d5eff313
https://doi.org/10.1109/impact.2018.8625789
https://doi.org/10.1109/impact.2018.8625789
Publikováno v:
2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Higher operation temperature and high current density requests of new generation power devices make it is more and more complicated to meet the quality requirements for power electronic modules. Especially the (silicon carbide) SiC and gallium nitrid
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::94b30ed61b36e86793d449da58000722
https://doi.org/10.1109/impact.2017.8255944
https://doi.org/10.1109/impact.2017.8255944
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 33:713-721
Light emitting diode (LED) with a long lifetime, low power consumption, and low pollution has been successfully applied in many products. However, due to its low electro-optical conversion efficiency, high percentage of input power transformed to red
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5388e4325a7f45c57faca45dc945519e
https://doi.org/10.1109/tcapt.2010.2073469
https://doi.org/10.1109/tcapt.2010.2073469
Publikováno v:
2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).
Light-emitting diode (LED), generally used for indicator light, has been developed for the past 50 years. Recently, LED has attracted many industries in the research and design of their products. However, its low electro-optical conversion efficiency
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a52e67fb534979f4c372f2ef38aca6bd
https://doi.org/10.1109/esime.2010.5464613
https://doi.org/10.1109/esime.2010.5464613
Publikováno v:
2008 10th Electronics Packaging Technology Conference.
This paper reports on the thermal characteristics of the high power LED package. The increment of input power generates more heat in the chip, decreasing the luminance and life span of LEDs. To enhance the efficiency of high power LEDs, challenges re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9232cf23d48ff01b9cd0df13ceed29ed
https://doi.org/10.1109/eptc.2008.4763488
https://doi.org/10.1109/eptc.2008.4763488
Autor:
Kun-Mu Lee, Shun-Hsiang Chan, Chang-Chieh Ting, Shih-Hsuan Chen, Wei-Hao Chiu, Vembu Suryanarayanan, Jen-Fu Hsu, Ching-Yuan Liu, Ming-Chung Wu
Publikováno v:
Nanomaterials, Vol 12, Iss 15, p 2651 (2022)
In recent years, additive engineering has received considerable attention for the fabrication of high-performance perovskite solar cells (PSCs). In this study, a non-ionic surfactant, polyoxyethylene (20) sorbitan monolaurate (Tween 20), was added as
Externí odkaz:
https://doaj.org/article/481b9287d81a494180ad1ae679b177ac