Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Wei-Cing Li"'
Autor:
Chun-Chia Chen, Tsu-Ming Liu, Min-Hao Chiu, Tung-Hsing Wu, Chi-cheng Ju, Wei-Cing Li, Yen-Chieh Lai, Yi-Hsin Huang, Peng-Hao Wang, Yen-Chao Huang, Chih-Ming Wang, Ping Chao, Hsiu-Yi Lin, Ming-Long Wu, Meng-Jye Hu, Yu-Kun Lin, Ting-An Lin, Chia-Yun Cheng, Che-Hong Chen, Sheng-Jen Wang, Shun-Hsiang Chuang, Han-Liang Chou, Chen Lien-Fei, Hue-Min Lin, Yung-Chang Chang, Chih-Da Chien, Kun-bin Lee
Publikováno v:
IEEE Journal of Solid-State Circuits. 51:56-67
A 4 K $\,\times\,$ 2 K H.265/HEVC video codec chip supporting 14 video standard formats is implemented on a 1.49 $\,\times\,$ 1.45 mm $^{2}$ die in a 28 nm CMOS process. Several HEVC fast algorithms reduce the coding modes by analyzing the content fe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4237a07f3493efd5831e6195d5e3fa3a
https://doi.org/10.1109/jssc.2015.2465857
https://doi.org/10.1109/jssc.2015.2465857
Autor:
Min-Hao Chiu, Yu-Kun Lin, Peng-Hao Wang, Tsu-Ming Liu, Yen-Chao Huang, Ping Chao, Kun-bin Lee, Han-Liang Chou, Hue-Min Lin, Chen Lien-Fei, Ryan Chen, Yung-Chang Chang, Ming-Long Wu, Kevin Jou, Wei-Cing Li, Yen-Chieh Lai, Yi-Hsin Huang, Che-Hong Chen, Tung-Hsing Wu, H Y Hsu, Sheng-Jen Wang, Chih-Da Chien, Ting-An Lin, Shun-Hsiang Chuang, Chun-Chia Chen, Chi-cheng Ju, Hsiu-Yi Lin, Chin-Ming Wang, Meng-Jye Hu, Chia-Yun Cheng, Fu-Chun Yeh
Publikováno v:
ISSCC
A 4K×2K H.265/HEVC video codec chip is fabricated in a 28nm CMOS process with a core area of 2.16mm2. This LSI chip integrates a dual-standard (H.265 and H.264) video codec and a series of prevalent (VC-1, WMV-7/8/9, VP-6/8, AVS, RM-8/9/10, MPEG-2/4
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::220b21ba0bbb83d403b694f7b2e5d1cb
https://doi.org/10.1109/isscc.2015.7063063
https://doi.org/10.1109/isscc.2015.7063063
Autor:
Yung-Chang Chang, Min-Hao Chiu, Kun-bin Lee, Chi-cheng Ju, Yi-Hsin Huang, Chih-Ming Wang, Yi-Hau Chen, Han-Liang Chou, Sheng-Jen Wang, Hsueh-Te Chao, Tung-Hsing Wu, Yu-Kun Lin, Chun-Chia Chen, Tin-An Lin, Hue-Min Lin, Tsu-Ming Liu, Tsung-Chuan Ma, Cheng-Hung Liu, Chia-Yun Cheng, Wei-Cing Li, Chung-Hung Tsai
Publikováno v:
2012 IEEE Asian Solid State Circuits Conference (A-SSCC).
A first dual-standard video encoder and decoder LSI providing VP8 (i.e. video format of WebM project for use of web's video) or H.264/AVC video recording and playback simultaneously is implemented with 28nm CMOS and occupies 1.94mm2 of core area. Sev
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::13821c7e7af4b566598d2b9c2fd9fa9b
https://doi.org/10.1109/ipec.2012.6522611
https://doi.org/10.1109/ipec.2012.6522611
Autor:
Wei-Cing Li, 李威慶
97
Duffing equation is one of the common nonlinear differential equations with a harmonic driving force and cubic nonlinearity. Many investigations described that the secondary responses coexist with the primary responses. Hsiao and Tung observe
Duffing equation is one of the common nonlinear differential equations with a harmonic driving force and cubic nonlinearity. Many investigations described that the secondary responses coexist with the primary responses. Hsiao and Tung observe
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/61696647106063177316
Autor:
Ju, Chi-Cheng, Liu, Tsu-Ming, Lee, Kun-Bin, Chang, Yung-Chang, Chou, Han-Liang, Wang, Chih-Ming, Wu, Tung-Hsing, Lin, Hue-Min, Huang, Yi-Hsin, Cheng, Chia-Yun, Lin, Ting-An, Chen, Chun-Chia, Lin, Yu-Kun, Chiu, Min-Hao, Li, Wei-Cing, Wang, Sheng-Jen, Lai, Yen-Chieh, Chao, Ping, Chien, Chih-Da, Hu, Meng-Jye
Publikováno v:
IEEE Journal of Solid-State Circuits; Jan2016, Vol. 51 Issue 1, p56-67, 12p
Autor:
Ju, Chi-Cheng, Liu, Tsu-Ming, Lee, Kun-Bin, Chang, Yung-Chang, Chou, Han-Liang, Wang, Chin-Ming, Wu, Tung-Hsing, Lin, Hue-Min, Huang, Yi-Hsin, Cheng, Chia-Yun, Lin, Ting-An, Chen, Chun-Chia, Lin, Yu-Kun, Chiu, Min-Hao, Li, Wei-Cing, Wang, Sheng-Jen, Lai, Yen-Chieh, Chao, Ping, Chien, Chih-Da, Hu, Meng-Jye
Publikováno v:
2015 IEEE International Solid-State Circuits Conference - (ISSCC) Digest of Technical Papers; 2015, p1-3, 3p