Zobrazeno 1 - 10
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pro vyhledávání: '"Wei-Chiao Wang"'
Autor:
Wei-Chiao Wang, 王薇喬
92
cPLA2α ( cytosolic phospholipase A2 α) is the major intracellular form ofPLA2, which selectively hydrolyzes membrane phospholipids at the sn-2 position, and the rate-limiting enzyme in the eicosanoid production. In thepresent study, we foun
cPLA2α ( cytosolic phospholipase A2 α) is the major intracellular form ofPLA2, which selectively hydrolyzes membrane phospholipids at the sn-2 position, and the rate-limiting enzyme in the eicosanoid production. In thepresent study, we foun
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/526cyz
Autor:
Wei-chiao Wang, 王薇喬
91
The carbon and oxygen isotopes of planktonic foraminifera, faunal assemblage, and coarse fraction of trap materials were analyzed in this study. The sediment traps were deployed in two lacations. One was in the Kao-ping submarine canyon and t
The carbon and oxygen isotopes of planktonic foraminifera, faunal assemblage, and coarse fraction of trap materials were analyzed in this study. The sediment traps were deployed in two lacations. One was in the Kao-ping submarine canyon and t
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/39582302362650671626
Autor:
Wei-Chiao Wang, Hsing-Chuan Peng, Yu-Cong Wang, Chia-Lin Hsieh, Sung-Mao Wu, Ming-Shan Lin, Yuan-Fu Ku
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Publikováno v:
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC).
Highly integration and complexity of modern system in package (SiP) lead to critical issues of Power Integrity (PI), Signal Integrity (SI) and Electromagnetic Compatibility (EMC). In this paper, the Simultaneous Switching Noise (SSN) inducing cavity
Publikováno v:
2019 International Conference on Electronics Packaging (ICEP).
With the advancement of technology and the electronics is getting smaller and smaller, the probability of being affected by electrostatic discharge (ESD) has also increased. The failure and destruction of electronic products caused by high voltage in
Publikováno v:
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
Nowadays, copper pillar bump is usually used in power IC and driver IC which in the environment of high current density and high temperature. When the energy is higher than active energy, electromigration happened and change the structure of package.
Autor:
Ben Kuen Chen, Liang Yi Hung, Jen-Hui Tsou, Wen Chang Chang, Wu Chou Su, Wei Chiao Wang, Kwang Yu Chang, Joseph T. Tseng
Publikováno v:
Nucleic Acids Research
The expression of cPLA2 is critical for transformed growth of non-small cell lung cancer (NSCLC). It is known that phorbol 12-myristate 13-acetate (PMA)-activated signal transduction pathway is thought to be involved in the oncogene action in NSCLC a
Publikováno v:
Marine Micropaleontology. 53:447-460
The imprint of seasonal hydrographic changes on two widely distributed tropical/subtropical planktonic foraminifer species, Globigerinoides sacculifer (without sac) and Globigerinoides ruber (white variety), has been investigated using specimens coll
Publikováno v:
The Journal of biological chemistry. 286(41)
The activation of cytosolic phospholipase A(2)α (cPLA(2)α) plays an important role in initiating the inflammatory response. The regulation of cPLA(2)α mRNA turnover has been proposed to control cPLA(2)α gene expression under cytokine and growth f