Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Wei, Shang Ping"'
Publikováno v:
Key Engineering Materials; February 2020, Vol. 830 Issue: 1 p1-8, 8p
Autor:
Wei, Shang-Ping, 魏上評
98
This study can be divided into two parts,The part 1 uses the Deform-3D software to conduct the dies design and forming simulation；The pare 2 uses the Autodesk Inventor CAD software to do the processing animation simulation. Part 1 assumes c
This study can be divided into two parts,The part 1 uses the Deform-3D software to conduct the dies design and forming simulation；The pare 2 uses the Autodesk Inventor CAD software to do the processing animation simulation. Part 1 assumes c
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/97611473942438679404
