Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Wedianti Shualdi"'
Publikováno v:
Advanced Materials Research. 1133:419-423
Eu (tta)3phen and Tb (4DBBA)3TPPO were synthesized as red and green phosphor for generating white light under the excitation of UV LED. The phosphor materials were doped into hybrid sol-gel (VTES:TEOS) matrix with different ratio of 1:8, 1:16, 1:25,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::33674c5991b026763d16699f630e48df
https://doi.org/10.4028/www.scientific.net/amr.1133.419
https://doi.org/10.4028/www.scientific.net/amr.1133.419
Autor:
Azreena Mastor, Siti Hajar Kasim, Siti Noorzidah Mohd Sabri, Syazana Abu Bakar, Mohd Nasha’ain Nordin, Ahmad Hazri Abdul Rashid, Wedianti Shualdi, Siti Farhana Hisham, Kartini Noorsal
Publikováno v:
Applied Mechanics and Materials. 815:89-93
The aim of this study was to investigate the effects of covalent and ionic cross-linked reactions which were respectively done by using genipin and tripolyphosphate (tpp), on the structure and mechanical properties of chitosan film. Both cross-linked
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b65007e14b08b4668806e3d4ef8332e9
https://doi.org/10.4028/www.scientific.net/amm.815.89
https://doi.org/10.4028/www.scientific.net/amm.815.89
Autor:
Nik Mohd Azmi, Nor Adhila Muhammad, Wedianti Shualdi, Nurul Huda Yusoff, Khairuldin Mohd Isha
Publikováno v:
Applied Mechanics and Materials. 815:182-187
This study reported thermal stability of hybrid sol-gel encapsulation materials doped with lanthanides complexes for generating white light. Red and green lanthanide phosphor, Eu (tta)3phen and Tb (4DBBA)3TPPO were incorporated into VTES:TEOS hybrid
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ee344799b35bbc89368fcb1f16a4d939
https://doi.org/10.4028/www.scientific.net/amm.815.182
https://doi.org/10.4028/www.scientific.net/amm.815.182
Autor:
Hasrina Hashim, Nik Mohd Azmi, Wedianti Shualdi, Mohamed Izat Mohd Ezwan, Ahmad Makarimi Abdullah, Farehah Ismail, Mohd Nasha’ain Nordin, Khairuldin Mohd Isha
Publikováno v:
Advanced Materials Research. 895:162-168
Low-Density Polyethylene films of 100 μm thickness doped with Eu (TTA)3phen complex was hot-blown by a lab scale extrusion process. The ratio of the complex was varied from 0%, 0.025%, 0.5%, 0.1%, to 0.2% with respect to the total weight of LDPE. Th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f36850588796006417196b1f0608bf0f
https://doi.org/10.4028/www.scientific.net/amr.895.162
https://doi.org/10.4028/www.scientific.net/amr.895.162
Publikováno v:
2011 IEEE Regional Symposium on Micro and Nano Electronics.
Intermetallic compound (IMC) plays great roles in connecting components to PCB boards, as well as die attach materials connecting chips to substrates. Cracks in IMC may leads to failure in an electronic product function. Therefore it is important to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9603d95e84cb9535aac0031295d71270
https://doi.org/10.1109/rsm.2011.6088328
https://doi.org/10.1109/rsm.2011.6088328
Publikováno v:
2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).
Intermetallic compound (IMC) growth behavior plays an important role in solder joint reliability of electronic packaging assemblies. The growth of interfacial IMC compounds and the interfacial voids/crack formation between Sn-25Ag-10Sb lead-free sold
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c71959737090aeaeb6c2bf888050d46f
https://doi.org/10.1109/iemt.2008.5507783
https://doi.org/10.1109/iemt.2008.5507783
Publikováno v:
2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT); 2008, p1-5, 5p