Zobrazeno 1 - 10
of 30
pro vyhledávání: '"Wayne H. Woods"'
Publikováno v:
Microwave and Optical Technology Letters. 52:673-677
A two-state single turn spiral inductor design is simulated in a 130 nm technology and another design is simulated and measured in a 45 nm technology. Measurements show an 80% inductance increase at 20 GHz in the 45 nm technology and a simulated 76%
Publikováno v:
Progress In Electromagnetics Research B. 22:171-185
Although the discontinuity structures in the microstrip transmission lines such as a gap and bend have been largely studied, the three-dimensional edge efiects, skin efiects and metal losses have hardly been analyzed. In this paper, modeling of trans
Autor:
V. H.-C. Chen, A. Balteanu, Mark Yeck, Mihai Sanduleanu, Jean-Olivier Plouchart, Daniel Friedman, Bodhisatwa Sadhu, Fa Wang, Alberto Valdes-Garcia, Benjamin D. Parker, Xin Li, Wayne H. Woods
Publikováno v:
2015 IEEE Radio Frequency Integrated Circuits Symposium (RFIC).
A self-healing mmWave SoC integrating an 8052 microcontroller with 12kB of memory, an ADC, a temperature sensor, and a 3-stage cascode 60GHz LNA, implemented in a 32nm SOI CMOS technology exhibits a peak gain of 21dB, an average 3.3dB NF from 53 to 6
Autor:
Essam Mina, Saikat Sarkar, Wayne H. Woods, B. Dufrene, Rajarshi Mukhopadhyay, Chang-Ho Lee, R.J. Pratap, Joy Laskar, P. Sen
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques. 54:2604-2614
This paper reports an interconnect modeling approach for RF and millimeter-wave integrated circuits (ICs) using neural network models and a novel parasitic extraction verification procedure using automatically generated test structures. The effects o
Publikováno v:
Microwave and Optical Technology Letters. 53:664-666
In this article, the design and measurement of a 77-GHz Marchand balun matched to 50 Ω single-ended and 100 Ω differential-ends using multiple metal layers in silicon technology is discussed. The balun is measured with an insertion loss of 1.8 dB a
Publikováno v:
CICC
This paper presents a tunable transmission line (t-line) structure, featuring independent control of line inductance and capacitance. The t-line provides variable delay while maintaining relatively constant characteristic impedance using direct digit
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Slow wave coplanar waveguide structures have been designed and implemented with the 3D steps; include alternating high and low impedance sections. The high impedance section is built with a narrow (w1), thin (t1) short (s) line and designed to have l
Autor:
Cole E. Zemke, Pinping Sun, Wayne H. Woods, Essam Mina, Barbara S. Dewitt, Nick Perez, Hailing Wang
Publikováno v:
ISQED
This paper presents a novel automated post-layout flow validation tool to intensively test the MOSFETs and passive components in 32nm, 28nm and 22nm Process Design Kits (PDK). Benchmark circuits, such as, ring oscillator, logic circuits and passive d
Autor:
Mark Doherty, Dan Vanslette, Anthony K. Stamper, Wayne H. Woods, Mete Erturk, Mike McPartlin, Alvin J. Joseph, Cheun-Wen Huang, James E. Dunn
Publikováno v:
Ultra-thin Chip Technology and Applications ISBN: 9781441972750
This chapter focuses on some of the radiofrequency (RF) and millimetre-wave (MMW) applications that a through-silicon via (TSV) technology can enable. We will first discuss a grounded TSV application for a RF wireless communication power amplifier th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a45319bd7732eda0abf47d06cf57d752
https://doi.org/10.1007/978-1-4419-7276-7_34
https://doi.org/10.1007/978-1-4419-7276-7_34
Autor:
J. Rascoe, John J. Pekarik, Hanyi Ding, Guoan Wang, Pinping Sun, Wayne H. Woods, Pascal Tannhof
Publikováno v:
The 40th European Microwave Conference.
A millimeter wave (MMW) on-chip passive frequency-dependent inductor is described with different designed inductance values targeted at different frequency ranges using one device. The proposed frequency-dependent inductor design allows the optimizat