Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Wataru Tachikawa"'
Publikováno v:
2023 IEEE Wireless Communications and Networking Conference (WCNC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::38f93ff03481312eb4d440d8958f6754
https://doi.org/10.1109/wcnc55385.2023.10118907
https://doi.org/10.1109/wcnc55385.2023.10118907
Publikováno v:
2022 IEEE 96th Vehicular Technology Conference (VTC2022-Fall).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4e2c579460eb8e1ddf5f6628601b5c84
https://doi.org/10.1109/vtc2022-fall57202.2022.10013047
https://doi.org/10.1109/vtc2022-fall57202.2022.10013047
Publikováno v:
2022 IEEE International Conference on Space Optical Systems and Applications (ICSOS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::27b0ba85d85df2dce8c088428e7a10a6
https://doi.org/10.1109/icsos53063.2022.9749721
https://doi.org/10.1109/icsos53063.2022.9749721
Publikováno v:
ICC
Non-Orthogonal Multiple Access (NOMA) is attracting attention as a key technology for 5G because of its high spectral efficiency and high throughput. In addition, satellite communication, especially Low Earth Orbit (LEO), is popular choice for global
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c39e141739ebfa769f949e3f1b7b8068
https://doi.org/10.1109/icc42927.2021.9500364
https://doi.org/10.1109/icc42927.2021.9500364
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
Cu-In fine pitch interconnects are a viable approach for low temperature bonding technologies in 2.5 D and 3D integration. The unique metallurgical phenomena regarding the phase formation and growth of intermetallic compounds (IMCs) in the Cu-In syst
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::57885cd49a66a4dbaf0f124eab6c569d
https://doi.org/10.1109/estc48849.2020.9229826
https://doi.org/10.1109/estc48849.2020.9229826
Autor:
Regina Cho, Yun-Hyeon Kim, Joseph F. Lachowski, Mark Lefebvre, Rosemary Bell, Inho Lee, Matthew Thorseth, Mitsuru Haga, Wataru Tachikawa, Mark Scalisi, Yi Qin, Jonathan Prange, yoon Joo Kim, Jeff Calvert
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2017:1-22
Advanced packaging technologies require materials which will allow for better resolution of patterns associated with the ever more challenging device architecture, along with materials that will allow for higher throughput. Device throughput can be i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e00aa1b68cdd4a77137240e75b10263e
https://doi.org/10.4071/2017dpc-wp1_presentation3
https://doi.org/10.4071/2017dpc-wp1_presentation3
Autor:
Yi Qin, Wataru Tachikawa, Jonathan Prange, Jeffrey M. Calvert, Masaaki Imanari, Mark Lefebvre, Jianwei Dong, Julia Woertink, Yil-Hak Lee, Matthew Thorseth, Inho Lee
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2015:000611-000638
Flip-chip interconnect and 3-D packaging applications must utilize reliable, high-performance metallization products in order to produce highly-efficient, low-cost microelectronic devices. As the market moves to shrinking device architectural feature
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::189718f5c60c6f075c174c673271b262
https://doi.org/10.4071/2015dpc-tp23
https://doi.org/10.4071/2015dpc-tp23
Autor:
Jeff Calvert, Jianwei Dong, Julia Woertink, Yi Qin, Erik Reddington, Inho Lee, Jonathan Prange, Wataru Tachikawa, Jui-Ching Lin, Pedro O. Lopez Montesinos, Masaaki Imanari
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:001417-001437
Control of height-uniformity, morphology, and interfacial properties is critical to achieving high-yield, high-reliability Copper Pillar and Copper Micro-Pillar capped structures for flip-chip and 3D Packaging applications. The plating chemistries se
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::163f1cc7f883d02ba9260cf680fdfef4
https://doi.org/10.4071/2013dpc-wp16
https://doi.org/10.4071/2013dpc-wp16
Autor:
Regina Cho, Emily Banelis, Lingyun Wei, Masaaki Imanari, Mark Lefebvre, Kristen Flajslik, Jianwei Dong, Brandon Sherzer, Inho Lee, Yi Qin, Jeffrey M. Calvert, Wataru Tachikawa, Louis Grippo
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
As the advancement of transistor nodes faces unprecedented challenges and work continues to extend Moore's law at the back end of the line (BEOL), packaging has become one of the fastest growing segments in the semiconductor industry. Lead-free solde
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7e320bfb81cf0a0a8420600e3d7b15c7
https://doi.org/10.1109/ectc.2016.22
https://doi.org/10.1109/ectc.2016.22
Autor:
Lingyun Wei, Matthew Thorseth, Mark Scalisi, Jonathan P Prange, Inho Lee, Yil-Hak Lee, yoon Joo Kim, Mark Lefebvre, Jeffrey Calvert, Wataru Tachikawa
Publikováno v:
ECS Meeting Abstracts. :1918-1918
Conventional acid electroplated copper is being widely used in semiconductor industries from back-end-of-the-line (BEOL) interconnects to advanced packaging applications such as copper pillar, redistribution layer (RDL) copper and Through Silicon Via
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eadc032983773a385bae353546d3b908
https://doi.org/10.1149/ma2016-02/29/1918
https://doi.org/10.1149/ma2016-02/29/1918