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pro vyhledávání: '"Warren Yiu-Cho Lai"'
Autor:
Chien-Shing Pai, T.W. Sorsch, E. Ferry, William M. Mansfield, R. Papazian, Daniel Lopez, Low Yee, David A. Ramsey, R. Frahm, Vladimir A. Aksyuk, E. Bower, F. Klemens, Flavio Pardo, John Vanatta Gates, R. Cirelli, Nagesh R. Basavanhally, Warren Yiu-Cho Lai, Pat G. Watson
Publikováno v:
IEEE Transactions on Advanced Packaging. 30:622-628
An ultra high-density hybrid integration for micro-electromechanical system (MEMS) mirror chips with several thousand inputs/outputs has been developed. The integration scheme involving flip-chip assembly provides electrical signal to individual mirr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::04daa39ac70895ede862d3dca47cb6d3
https://doi.org/10.1109/tadvp.2007.906395
https://doi.org/10.1109/tadvp.2007.906395
