Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Wanyu Tie"'
Publikováno v:
2012 2nd IEEE CPMT Symposium Japan.
In this report, authors describe improvement effort of fine pitch flip-chip interconnection based on pre-applied material process. For evaluation, IC with copper pillar bumps (50 μm pitch) and organic boards (FR-5) have been used. NCF and B-stage ma
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::75ddec37968604613a3f059e155b895e
https://doi.org/10.1109/icsj.2012.6523392
https://doi.org/10.1109/icsj.2012.6523392
Publikováno v:
2012 2nd IEEE CPMT Symposium Japan; 2012, p1-4, 4p