Zobrazeno 1 - 10
of 27
pro vyhledávání: '"Wang, Ruomin"'
Autor:
Cheng, Xiang1 (AUTHOR) chengxiang2083@163.com, Wang, Ruomin1 (AUTHOR) wangruoju@163.com, Chen, Xiaolu1 (AUTHOR) akalune@outlook.com, Jin, Shasha1 (AUTHOR) 18256977811@163.com, Qian, Qinke2 (AUTHOR) 15851588327@163.com, Wu, He2,3 (AUTHOR) wuhe@njtec.edu.cn
Publikováno v:
Materials (1996-1944). Jul2024, Vol. 17 Issue 14, p3400. 17p.
Autor:
Wang, Ruomin
En raison de l'évolution technologique, l'analyse de l'intégrité du signal est devenue de plus en plus critique dans la conception des systèmes électroniques. Plusieurs méthodes d'analyse ont été proposées et sont utilisées. Cependant, l'h
Externí odkaz:
http://www.theses.fr/2014PA066196/document
Autor:
Liao, Zhiheng, Guo, Chunsheng, Meng, Ju, Jiang, Boyang, Gao, Li, Su, Ya, Wang, Ruomin, Feng, Shiwei
Publikováno v:
In Microelectronics Reliability July 2017 74:52-57
Akademický článek
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Autor:
Chen Guohong, Zhang Jian, Wang Ruomin, Li Jianlin, Miao Chunhui, Mugang Duan, Xuejin Chen, Wenming Tang
Publikováno v:
Journal of Materials Engineering and Performance. 30:4552-4561
The precipitation of secondary phases, the austenite grain growth and their effects on the mechanical properties of the HR3C heat-resistant steel in long-term service at 605 °C in an ultra-supercritical power generation unit were investigated. The r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7cbbd13a01d5dc41c50cf6c0ae50c8b2
https://doi.org/10.1007/s11665-021-05754-9
https://doi.org/10.1007/s11665-021-05754-9
Akademický článek
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Autor:
Wenming Tang, Miao Chunhui, Chen Guohong, Binhao Wang, Wang Ruomin, Zhi-xiang Zheng, Zhang Jian
Publikováno v:
Transactions of Nonferrous Metals Society of China. 26:3283-3291
Cu/Al laminar composite was prepared by dipping Zn layer and then electroplating Cu thick layer on pure Al sheet. During annealing the Cu/Al composites at temperature from 473 to 673 K, the Cu/Al interfacial diffusion and reaction and its kinetics an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4b5a1d09a03db332c8c893d3e5abfdfe
https://doi.org/10.1016/s1003-6326(16)64462-x
https://doi.org/10.1016/s1003-6326(16)64462-x
Publikováno v:
Conference on Design of Circuits and Integrated Systems (DCIS)
Conference on Design of Circuits and Integrated Systems (DCIS), Nov 2013, Donostia-San Sebastian, Spain. pp.1-4
Conference on Design of Circuits and Integrated Systems (DCIS), Nov 2013, Donostia-San Sebastian, Spain. pp.1-4
International audience; This paper addresses the modeling, at a high level of abstraction, of the functionality and Signal Integrity (SI) performances in a high frequency Point-to-Point connections (P2P) system. Our model is a unique platform, which
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::cd13e8ffcca66732750daf8b19e1688f
https://hal.archives-ouvertes.fr/hal-00968672
https://hal.archives-ouvertes.fr/hal-00968672
Publikováno v:
FDL 2013-Forum on Specification Design Languages
FDL 2013-Forum on Specification Design Languages, Sep 2013, Paris, France. pp.1-6
FDL 2013-Forum on Specification Design Languages, Sep 2013, Paris, France. pp.1-6
International audience; The paper presents a new method for modeling the functionality and Signal Integrity (SI) performances of bus communications at a high level of abstraction. Using neural networks, we build a SystemC/SystemC-AMS virtual platform
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::b9504704d1f514fcbd139977e227c4b5
https://hal.archives-ouvertes.fr/hal-00968667
https://hal.archives-ouvertes.fr/hal-00968667
Publikováno v:
Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing (MiNaPAD)
Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing (MiNaPAD), May 2014, Grenoble, France
Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing (MiNaPAD), May 2014, Grenoble, France
International audience
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::ed5007caaeba039138739771fac7f916
https://hal.science/hal-01201797
https://hal.science/hal-01201797