Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Wang, Bor Kai"'
Autor:
Niu, Tzu-ling, Yang, Chi-Hsiang, Chen, Wei-shin, Wang, Bor-Kai, Mi, Xiang-Dong, Teng, Hsuan-Yu, Sullivan, Andy, Ishikawa, Tomohiro
Publikováno v:
SID Symposium Digest of Technical Papers; Jun2022, Vol. 53 Issue 1, p662-665, 4p
Autor:
Shen, Wen-Wei, Chang, Hsiang-Hung, Wang, Jen-Chun, Ko, Cheng-Ta, Tsai, Leon, Wang, Bor Kai, Shorey, Aric, Lee, Alvin, Su, Jay, Bai, Dongshun, Huang, Baron, Lo, Wei-Chung, Chen, Kuan-Neng
Publikováno v:
2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p1652-1657, 6p
Autor:
Wang, Bor-Kai, 王柏凱
86
Magnetism in bulk solids is a well developed research area which has provided a fertile testing ground for quantum mechanics, theories of many-body interact ions and collective phenomena. In the 1980's, magnetic properties ofsurfaces, interfa
Magnetism in bulk solids is a well developed research area which has provided a fertile testing ground for quantum mechanics, theories of many-body interact ions and collective phenomena. In the 1980's, magnetic properties ofsurfaces, interfa
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/88900575295954826405
Autor:
Tsai, Leon, Wang, Bor Kai, Shorey, Aric, Lee, Alvin, Su, Jay, Huang, Baron, Shen, Wen-Wei, Chang, Hsiang-Hung, Chien, C. H.
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC); 2014, p545-548, 4p
Publikováno v:
ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference; 2013, p142-147, 6p
Publikováno v:
2013 IEEE 63rd Electronic Components & Technology Conference; 2013, p1724-1727, 4p
Publikováno v:
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013); 2013, p706-709, 4p
Publikováno v:
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013); 2013, p673-676, 4p
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC); 2012, p598-601, 4p
Thin glass substrates development and integration for through glass vias (TGV) with Cu interconnect.
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC); 2012, p351-354, 4p