Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Wang, Aile"'
Publikováno v:
*McMaster only.
Thesis (Ph.D.)--McMaster University, 2005.
Supervisor: Shiping Zhu. Includes bibliographical references.
Supervisor: Shiping Zhu. Includes bibliographical references.
Publikováno v:
In Applied Surface Science 12 November 2024 673
Autor:
Zhang, Min a, b, Li, Zihao a, Touqeer, Muhammad a, b, Dong, Shuai a, b, Zhao, Kesen a, b, Wang, Aile a, Wang, Ze b, c, Zhang, Jing b, c, Wang, Jihao b, c, Meng, Wenjie b, c, ⁎, Feng, Qiyuan b, c, Lu, Yalin a, d, Hou, Yubin b, c, ⁎, Lu, Qingyou a, b, c, d, ⁎⁎
Publikováno v:
In Micron March 2025 190
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Autor:
Zhang M; University of Science and Technology of China, Hefei 230026, China; Anhui Key Laboratory of Low-Energy Quantum Materials and Devices, High Magnetic Field Laboratory, HFIPS, Chinese Academy of Sciences, Hefei 230031, China., Li Z; University of Science and Technology of China, Hefei 230026, China., Touqeer M; University of Science and Technology of China, Hefei 230026, China; Anhui Key Laboratory of Low-Energy Quantum Materials and Devices, High Magnetic Field Laboratory, HFIPS, Chinese Academy of Sciences, Hefei 230031, China., Dong S; University of Science and Technology of China, Hefei 230026, China; Anhui Key Laboratory of Low-Energy Quantum Materials and Devices, High Magnetic Field Laboratory, HFIPS, Chinese Academy of Sciences, Hefei 230031, China., Zhao K; University of Science and Technology of China, Hefei 230026, China; Anhui Key Laboratory of Low-Energy Quantum Materials and Devices, High Magnetic Field Laboratory, HFIPS, Chinese Academy of Sciences, Hefei 230031, China., Wang A; University of Science and Technology of China, Hefei 230026, China., Wang Z; Anhui Key Laboratory of Low-Energy Quantum Materials and Devices, High Magnetic Field Laboratory, HFIPS, Chinese Academy of Sciences, Hefei 230031, China; High Magnetic Field Laboratory of Anhui Province, Hefei 230031, China., Zhang J; Anhui Key Laboratory of Low-Energy Quantum Materials and Devices, High Magnetic Field Laboratory, HFIPS, Chinese Academy of Sciences, Hefei 230031, China; High Magnetic Field Laboratory of Anhui Province, Hefei 230031, China., Wang J; Anhui Key Laboratory of Low-Energy Quantum Materials and Devices, High Magnetic Field Laboratory, HFIPS, Chinese Academy of Sciences, Hefei 230031, China; High Magnetic Field Laboratory of Anhui Province, Hefei 230031, China., Meng W; Anhui Key Laboratory of Low-Energy Quantum Materials and Devices, High Magnetic Field Laboratory, HFIPS, Chinese Academy of Sciences, Hefei 230031, China; High Magnetic Field Laboratory of Anhui Province, Hefei 230031, China. Electronic address: wjmeng@hmfl.ac.cn., Feng Q; Anhui Key Laboratory of Low-Energy Quantum Materials and Devices, High Magnetic Field Laboratory, HFIPS, Chinese Academy of Sciences, Hefei 230031, China; High Magnetic Field Laboratory of Anhui Province, Hefei 230031, China., Lu Y; University of Science and Technology of China, Hefei 230026, China; Anhui Laboratory of Advanced Photon Science and Technology, University of Science and Technology of China, Hefei 230026, China., Hou Y; Anhui Key Laboratory of Low-Energy Quantum Materials and Devices, High Magnetic Field Laboratory, HFIPS, Chinese Academy of Sciences, Hefei 230031, China; High Magnetic Field Laboratory of Anhui Province, Hefei 230031, China. Electronic address: ybhou@hmfl.ac.cn., Lu Q; University of Science and Technology of China, Hefei 230026, China; Anhui Key Laboratory of Low-Energy Quantum Materials and Devices, High Magnetic Field Laboratory, HFIPS, Chinese Academy of Sciences, Hefei 230031, China; High Magnetic Field Laboratory of Anhui Province, Hefei 230031, China; Anhui Laboratory of Advanced Photon Science and Technology, University of Science and Technology of China, Hefei 230026, China. Electronic address: qxl@ustc.edu.cn.
Publikováno v:
Micron (Oxford, England : 1993) [Micron] 2024 Dec 22; Vol. 190, pp. 103777. Date of Electronic Publication: 2024 Dec 22.