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Publikováno v:
International Symposium for Testing and Failure Analysis.
During the wafer-sort stage, critical electrical data on the IC chip performance is collected. As technology advances, smaller geometries are continuously implemented to the production line and, as a result, there may be some issues that are difficul
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f875faab7ad03539a1a1513d641dbe78
https://doi.org/10.31399/asm.cp.istfa2004p0419
https://doi.org/10.31399/asm.cp.istfa2004p0419
