Zobrazeno 1 - 10
of 38
pro vyhledávání: '"Wan-Chun Chuang"'
Publikováno v:
Sensors, Vol 15, Iss 2, Pp 3975-3987 (2015)
This research aims at developing a flexible strain module applied to the strengthening of back muscles. Silver films were sputtered onto flexible substrates to produce a flexible sensor. Assuming that back muscle elongation is positively correlated w
Externí odkaz:
https://doaj.org/article/6bb8dae536324f78987093fcbb9792ad
Publikováno v:
Sensors, Vol 12, Iss 12, Pp 17094-17111 (2012)
This paper develops the technologies of mechanical characterization of CMOS-MEMS devices, and presents a robust algorithm for extracting mechanical properties, such as Young’s modulus, and mean stress, through the external electrical circuit behavi
Externí odkaz:
https://doaj.org/article/4240ef7e48344825a4b29331f7708a37
Publikováno v:
Sensors, Vol 10, Iss 6, Pp 6149-6171 (2010)
Electrostatic-driven microelectromechanical systems devices, in most cases, consist of couplings of such energy domains as electromechanics, optical electricity, thermoelectricity, and electromagnetism. Their nonlinear working state makes their analy
Externí odkaz:
https://doaj.org/article/f4d54604e912419d9bdaed3a223c354f
Autor:
Wan-Chun Chuang, 莊婉君
107
This study examines the relationship among independent director' political connection, investment efficiency and firm performance. Panel data analysis is utilized and the data are from Chinese listed firms over the period 2008-2016. The empi
This study examines the relationship among independent director' political connection, investment efficiency and firm performance. Panel data analysis is utilized and the data are from Chinese listed firms over the period 2008-2016. The empi
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/8ay575
Autor:
Wan-Chun Chuang, 莊婉君
99
This research develops the technologies of mechanical characterization of CMOS-MEMS devices, and presents a robust algorithm for extracting mechanical properties, such as Young’s modulus, mean stress, and gradient stress, through the extern
This research develops the technologies of mechanical characterization of CMOS-MEMS devices, and presents a robust algorithm for extracting mechanical properties, such as Young’s modulus, mean stress, and gradient stress, through the extern
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/90889330348960568144
Autor:
Wan-Chun Chuang, 莊婉君
98
Spinocerebellar ataxia type 8 (SCA8) is an autosomal dominant late-onset neurodegenerative disease. The cause of SCA8 was originally proposed associated with CTG trinucleotide repeat at 3’UTR (untranslated region) of ATXN8OS gene, lying on
Spinocerebellar ataxia type 8 (SCA8) is an autosomal dominant late-onset neurodegenerative disease. The cause of SCA8 was originally proposed associated with CTG trinucleotide repeat at 3’UTR (untranslated region) of ATXN8OS gene, lying on
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/59967318525036138906
Autor:
Wan-Chun Chuang, 莊婉君
95
This paper derives an approximate analytical solution to the pull-in voltage of micro bridge with non-ideal boundaries, fringing field capacitance and residual stresses. Besides, this paper also presents a novel and high-precision algorithm a
This paper derives an approximate analytical solution to the pull-in voltage of micro bridge with non-ideal boundaries, fringing field capacitance and residual stresses. Besides, this paper also presents a novel and high-precision algorithm a
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/86812845076952543522
Autor:
Wan-chun Chuang, 莊琬君
94
Lady Oracle is Margaret Atwood’s third novel in my view, stands as a transitional work in her treatment of the issues of mother-daughter relationship and daughter as female artist. In Atwood’s corpus, it is the first novel in which the da
Lady Oracle is Margaret Atwood’s third novel in my view, stands as a transitional work in her treatment of the issues of mother-daughter relationship and daughter as female artist. In Atwood’s corpus, it is the first novel in which the da
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/04185544825968440990
Publikováno v:
Materials; Volume 16; Issue 9; Pages: 3482
This study investigated the impact of material properties of epoxy molding compounds on wafer warpage in fan-out wafer-level packaging. As there is currently a lack of comprehensive discussion on the various material property parameters of EMC materi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3a8ee6c2c3dc62c822d02d3deff6c02e
https://doi.org/10.3390/ma16093482
https://doi.org/10.3390/ma16093482
Autor:
Wan-Chun Chuang, Wei-Long Chen
Publikováno v:
Materials
Materials, Vol 15, Iss 323, p 323 (2022)
Materials; Volume 15; Issue 1; Pages: 323
Materials, Vol 15, Iss 323, p 323 (2022)
Materials; Volume 15; Issue 1; Pages: 323
This study successfully established a strip warpage simulation model of the flip-chip process and investigated the effects of structural design and process (molding, post-mold curing, pretreatment, and ball mounting) on strip warpage. The errors betw
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bd0cf784f94222f91e3a62a74b0be87b
https://pubmed.ncbi.nlm.nih.gov/35009468
https://pubmed.ncbi.nlm.nih.gov/35009468