Zobrazeno 1 - 10
of 56
pro vyhledávání: '"Wan-Chun Chuang"'
Publikováno v:
Sensors, Vol 15, Iss 2, Pp 3975-3987 (2015)
This research aims at developing a flexible strain module applied to the strengthening of back muscles. Silver films were sputtered onto flexible substrates to produce a flexible sensor. Assuming that back muscle elongation is positively correlated w
Externí odkaz:
https://doaj.org/article/6bb8dae536324f78987093fcbb9792ad
Publikováno v:
Materials; Volume 16; Issue 9; Pages: 3482
This study investigated the impact of material properties of epoxy molding compounds on wafer warpage in fan-out wafer-level packaging. As there is currently a lack of comprehensive discussion on the various material property parameters of EMC materi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3a8ee6c2c3dc62c822d02d3deff6c02e
https://doi.org/10.3390/ma16093482
https://doi.org/10.3390/ma16093482
Publikováno v:
Sensors, Vol 12, Iss 12, Pp 17094-17111 (2012)
This paper develops the technologies of mechanical characterization of CMOS-MEMS devices, and presents a robust algorithm for extracting mechanical properties, such as Young’s modulus, and mean stress, through the external electrical circuit behavi
Externí odkaz:
https://doaj.org/article/4240ef7e48344825a4b29331f7708a37
Publikováno v:
Sensors, Vol 10, Iss 6, Pp 6149-6171 (2010)
Electrostatic-driven microelectromechanical systems devices, in most cases, consist of couplings of such energy domains as electromechanics, optical electricity, thermoelectricity, and electromagnetism. Their nonlinear working state makes their analy
Externí odkaz:
https://doaj.org/article/f4d54604e912419d9bdaed3a223c354f
Autor:
Wan-Chun Chuang, Wei-Long Chen
Publikováno v:
Materials
Materials, Vol 15, Iss 323, p 323 (2022)
Materials; Volume 15; Issue 1; Pages: 323
Materials, Vol 15, Iss 323, p 323 (2022)
Materials; Volume 15; Issue 1; Pages: 323
This study successfully established a strip warpage simulation model of the flip-chip process and investigated the effects of structural design and process (molding, post-mold curing, pretreatment, and ball mounting) on strip warpage. The errors betw
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bd0cf784f94222f91e3a62a74b0be87b
https://pubmed.ncbi.nlm.nih.gov/35009468
https://pubmed.ncbi.nlm.nih.gov/35009468
Autor:
Wan-Chun Chuang, Wei-Long Chen
Publikováno v:
Journal of the Chinese Institute of Engineers. 42:290-296
This study has successfully established a simulation model for dicing tape expansion. COMSOL Multiphysics simulation software was used to investigate the spacing condition before separating the die...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cf35be0dfa3d9fd1b2197645eedd73f6
https://doi.org/10.1080/02533839.2019.1584736
https://doi.org/10.1080/02533839.2019.1584736
Autor:
Wan-Chun Chuang, Wei-Long Chen
Publikováno v:
Journal of Electronic Packaging. 142
This study successfully established a strip warpage simulation model that is applied to the wire bonding process, and explored the effects of structural designs, material types, and processes such as molding, post and mold cure (PMC), pretreatment, a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a3e63e13abb5094492d7d762b9f806b9
https://doi.org/10.1115/1.4045362
https://doi.org/10.1115/1.4045362
Autor:
Wan-Chun Chuang1 wcchuang@mail.nsysu.edu.tw, Yuh-Chung Hu2 ychu@niu.edu.tw, Pei-Zen Chang3 changpz@ntu.edu.tw
Publikováno v:
Sensors (14248220). Dec2012, Vol. 12 Issue 12, p17094-17111. 18p. 1 Color Photograph, 1 Black and White Photograph, 3 Diagrams, 9 Charts, 3 Graphs.
Autor:
Wan-Chun Chuang, Wei-Long Chen
Publikováno v:
Journal of Electronic Packaging. 142
A molded wafer-level package simulation model was successfully developed for calculating solder ball fatigue life during a temperature cycle test (TCT), revealing that the most crucial factor affecting fatigue life, rather than being the maximal stre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::51b110f723b28ccaafc2e00dcc504544
https://doi.org/10.1115/1.4044489
https://doi.org/10.1115/1.4044489
Autor:
Wan-Chun Chuang, 莊婉君
107
This study examines the relationship among independent director' political connection, investment efficiency and firm performance. Panel data analysis is utilized and the data are from Chinese listed firms over the period 2008-2016. The empi
This study examines the relationship among independent director' political connection, investment efficiency and firm performance. Panel data analysis is utilized and the data are from Chinese listed firms over the period 2008-2016. The empi
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/8ay575
