Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Waltraud Hell"'
Publikováno v:
2021 Smart Systems Integration (SSI).
We present a simple and reliable hybrid packaging of rigid electrochemical transducers and flexible foil having electrical connections. Among a large number of biochemical transducers, we target in this work two types of transducers: 3-electrode syst
Autor:
Waltraud Hell, Andreas Drost, Christoph Kutter, Karlheinz Bock, Christof Landesberger, Nagarajan Palavesam
Publikováno v:
Electronics
Volume 9
Issue 2
Electronics, Vol 9, Iss 2, p 238 (2020)
Volume 9
Issue 2
Electronics, Vol 9, Iss 2, p 238 (2020)
The growing interest towards thinner and conformable electronic systems has attracted significant attention towards flexible hybrid electronics (FHE). Thin chip-foil packages fabricated by integrating ultra-thin monocrystalline silicon integrated cir
Autor:
Christoph Kutter, Christof Landesberger, Waltraud Hell, Karlheinz Bock, Nagarajan Palavesam, Andreas Drost
Publikováno v:
2019 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
The emerging Internet-of-Everything (IoE) framework aims to revolutionise human-machine interaction where billions of sensors and actuators placed on almost every physical object will be tasked to communicate with each other. A substantial fraction o
Autor:
Christoph Kutter, Nagarajan Palavesam, Christof Landesberger, Karlheinz Bock, Waltraud Hell, Erwin Yacoub-George
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
With the emergence of the Internet-of-Things (IoT) and wearable devices in the recent years, Flexible Hybrid Electronics (FHEs) has attracted significant attention. Chip-foil packages (also known as flexible interposers) fabricated by integrating ult
Autor:
Christoph Kutter, Christof Landesberger, Horst Gieser, Nagarajan Palavesam, Detlef Bonfert, Waltraud Hell, Karlheinz Bock
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
We report our results on the comparative studies of the influence of chip thickness and dicing technique on the mechanical reliability of flip-chip bonded ultra-thin chip-on-foil (COF) assemblies under two different types of recurrent bending, free f
Autor:
Karlheinz Bock, Christoph Kutter, Horst Gieser, Christof Landesberger, Waltraud Hell, Nagarajan Palavesam, Andreas Drost, Detlef Bonfert, R. Faul
Publikováno v:
2016 International Conference on Electronics Packaging (ICEP).
We present technological results on the embedding of ultra-thin microcontroller ICs in flexible film substrates. The novel concept is based on the following technologies: face-up chip mounting in cavities on film laminates, photo-lithographic pattern
Autor:
Christof Landesberger, Waltraud Hell, Christoph Kutter, Karlheinz Bock, Nagarajan Palavesam, Detlef Bonfert, Horst Gieser
Publikováno v:
2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME).
We present our results on the analysis of electrical performance of Flip-Chip bonded thin Silicon chip-on-foil assemblies during bending. A custom made bending machine was utilized to bend the test samples and the electrical resistance of the Daisy C
Autor:
Ulrich Reidt, Andreas Helwig, Gudrun Preuß, Hans Wolf, Leonhard Meixner, Waltraud Hell, Alois Friedberger, Ninette Zullei-Seibert, Ramona Molz, Karl Neumeier, Petra Lindner, Christoph Heller, Karlheinz Bock, Clemens Homann
Publikováno v:
Optik & Photonik. 4:28-31
Wasser ist Leben und so ist es in Deutschland auch das am besten kontrollierte Lebensmittel. Verunreinigungen aller Art sind darin tabu. Besonders Bakterien sind als lebende Organismen im „Lebensmitteln Nr. 1” nicht willkommen. Wasserversorger mu
Autor:
Horst Gieser, Waltraud Hell, Gerhard Klink, Andreas Drost, Christoph Kutter, H. Wolf, Erwin Yacoub-George, Karlheinz Bock, Dieter Bollmann, Christof Landesberger
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
In this paper we present a technology developed for reliable electrical interconnection on film substrates and between vertically stacked film layers. Applying through-hole via technologies for 3D foil stacks enables multi-functionality and RF perfor
Publikováno v:
3rd Electronics System Integration Technology Conference ESTC.
The paper reports on a self-assembly process that enables both self-alignment of microelectronic devices and self-interconnection of devices with the surrounding electrical wiring. The complete process was successfully demonstrated using state-of-the