Zobrazeno 1 - 10
of 114
pro vyhledávání: '"Walter Sextro"'
Autor:
Jan Schütte, Walter Sextro
Publikováno v:
Vehicles, Vol 3, Iss 2, Pp 233-256 (2021)
To analyze the influence of suspension kinematics on tire wear, detailed simulation models are required. In this study, a non-linear, flexible multibody model of a rear axle system is built up in the simulation software MSC Adams/View. The physical m
Externí odkaz:
https://doaj.org/article/7971a57adbb74d3ca94ddb2f91b176b8
Publikováno v:
Actuators, Vol 9, Iss 1, p 9 (2020)
Ultrasonic acoustic standing wave systems find use in many industrial applications, such as sonochemical reactions, atomization of liquids, ultrasonic cleaning, and spray dry. In most applications, highest possible sound pressure levels are needed to
Externí odkaz:
https://doaj.org/article/91195e84820549b5987e28e33add69c9
Publikováno v:
Actuators, Vol 7, Iss 2, p 18 (2018)
Since fine powders tend strongly to adhesion and agglomeration, their processing with conventional methods is difficult or impossible. Typically, in order to enable the handling of fine powders, chemicals are added to increase the flowability and red
Externí odkaz:
https://doaj.org/article/0e55a4c199ea456f9df8034b6f916cf6
Publikováno v:
International Journal of Rotating Machinery, Vol 9, Iss 3, Pp 219-228 (2003)
Externí odkaz:
https://doaj.org/article/6b0f34f070c14f80bb1ed2e29b052305
Publikováno v:
International Journal of Prognostics and Health Management, Vol 4, Iss 2 (2013)
This study presents the methods employed by a team from the department of Mechatronics and Dynamics at the University of Paderborn, Germany for the 2013 PHM data challenge. The focus of the challenge was on maintenance action recommendation for an i
Externí odkaz:
https://doaj.org/article/db0037fd422b4d0ba6916aa5b6c803a2
Publikováno v:
International Symposium on Microelectronics. 2021:000346-000355
Ultrasonic heavy wire bonding is a standard process in packaging technologies of power semiconductor modules. Due to increasing demands on reliability of the electrical contacts under high temperature loads, copper wires with significantly better ele
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f8ba6ec009935db306d14bc646cbeecb
https://doi.org/10.4071/1085-8024-2021.1.000346
https://doi.org/10.4071/1085-8024-2021.1.000346
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fe29310d7d8cba4e1102170d00085fcb
https://doi.org/10.1109/estc55720.2022.9939478
https://doi.org/10.1109/estc55720.2022.9939478
Publikováno v:
Lecture Notes in Mechanical Engineering ISBN: 9783031073045
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d8f153184a367c47699a29e56699396c
https://doi.org/10.1007/978-3-031-07305-2_92
https://doi.org/10.1007/978-3-031-07305-2_92
Autor:
Reinhard Schemmel, Florian Eacock, Walter Sextro, Collin Dymel, Matthias Hunstig, Michael Brökelmann, Tobias Hemsel
Publikováno v:
International Symposium on Microelectronics. 2019:000509-000514
Ultrasonic joining is a common industrial process. To build electrical connections in the electronics industry, uni-axial and torsional ultrasonic vibration have been used to join different types of workpieces for decades. Many influencing factors li
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2596d2c7f7e8e0321971a5ae62108f17
https://doi.org/10.4071/2380-4505-2019.1.000509
https://doi.org/10.4071/2380-4505-2019.1.000509
Autor:
Collin Dymel, Walter Sextro, Matthias Hunstig, Tobias Hemsel, Reinhard Schemmel, Michael Brökelmann
Publikováno v:
Sensors and Actuators A: Physical. 295:653-662
Ultrasonic joining is a common industrial process. In the electronics industry it is used to form electrical connections, including those of dissimilar materials. Multiple influencing factors in ultrasonic joining are known and extensively investigat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b91780c4edd26a9207dbd40037de8a83
https://doi.org/10.1016/j.sna.2019.04.025
https://doi.org/10.1016/j.sna.2019.04.025