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pro vyhledávání: '"Walter Jau"'
Autor:
Homing Tong, Ker-Chang Hsieh, Simon Su, Tom Tai, Adren Hsieh, Jui-I Yu, Rick Yu, Walter Jau, Danial Huang
Publikováno v:
2006 International Microsystems, Package, Assembly Conference Taiwan.
Wafer bumping is growing in importance with the increasing used of Flip Chip package. In this study, we tried to determine which factors at photosensitive film lithography process had an effect on photosensitive film sidewall profile. The analysis of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b999c1e768858c582634099b587b2c2e
https://doi.org/10.1109/impact.2006.312207
https://doi.org/10.1109/impact.2006.312207
