Zobrazeno 1 - 10
of 104
pro vyhledávání: '"Walied A. Moussa"'
Publikováno v:
Sensors, Vol 15, Iss 6, Pp 12218-12241 (2015)
This paper presents the methodology and challenges experienced in the microfabrication, packaging, and integration of a fixed-fixed folded spring piezoelectric energy harvester. A variety of challenges were overcome in the fabrication of the energy h
Externí odkaz:
https://doaj.org/article/00173f11bf194bebaf5403bf04229a3b
Publikováno v:
Sensors, Vol 11, Iss 2, Pp 1819-1846 (2011)
This paper presents the experimental evaluation of a new piezoresistive MEMS strain sensor. Geometric characteristics of the sensor silicon carrier have been employed to improve the sensor sensitivity. Surface features or trenches have been introduce
Externí odkaz:
https://doaj.org/article/8c6e2e3b48174d2d93ef097a1fe9f146
Autor:
Jonathan Lueke, Walied A. Moussa
Publikováno v:
Sensors, Vol 11, Iss 2, Pp 1433-1460 (2011)
Implantable biosensing is attractive for both medical monitoring and diagnostic applications. It is possible to monitor phenomena such as physical loads on joints or implants, vital signs, or osseointegration in vivo and in real time. Microelectromec
Externí odkaz:
https://doaj.org/article/b25cd4c00b104286a46861d4e7ce6ba6
Autor:
Walied A. Moussa, Mohamed M. EL Gowini
Publikováno v:
Sensors, Vol 10, Iss 2, Pp 1232-1250 (2010)
Hydrogen plays a significant role in various industrial applications, but careful handling and continuous monitoring are crucial since it is explosive when mixed with air. Surface Acoustic Wave (SAW) sensors provide desirable characteristics for hydr
Externí odkaz:
https://doaj.org/article/32547a253ad94ae2a4cf7654f1d1204e
Autor:
Mohamed M. El Gowini, Walied A. Moussa
Publikováno v:
Sensors, Vol 9, Iss 12, Pp 9945-9964 (2009)
A major problem that often arises in modeling Micro Electro Mechanical Systems (MEMS) such as Surface Acoustic Wave (SAW) sensors using Finite Element Analysis (FEA) is the extensive computational capacity required. In this study a new approach is ad
Externí odkaz:
https://doaj.org/article/e77b53cd9e31473bb03bad02ad8089ac
Publikováno v:
Sensors, Vol 8, Iss 4, Pp 2642-2661 (2008)
In this article, we report on the new design of a miniaturized strain microsensor. The proposed sensor utilizes the piezoresistive properties of doped single crystal silicon. Employing the Micro Electro Mechanical Systems (MEMS) technology, high sens
Externí odkaz:
https://doaj.org/article/9b540a2f77044aebbc03d6f7606c0330
Publikováno v:
IEEE/ASME Transactions on Mechatronics. 26:1076-1083
A new 3-D stress sensor that features strain engineering is developed with the capability of extracting the six stress components in a full temperature compensation manner. This article presents the detailed testing of the out-of-plane shear and norm
Publikováno v:
IEEE Sensors Journal. 20:13310-13317
This paper proposes a new hybrid temperature compensation system for doped silicon-based piezoresistive 3D stress sensors. The developed compensation system integrates a temperature sensor, placed in close proximity to the stress sensing rosettes, wi
Publikováno v:
IEEE Sensors Journal. 20:1176-1183
In this paper, a developed n-type piezoresistive three dimensional (3D) stress sensor with full temperature compensation is presented. The proposed sensing rosette benefits from the stress insensitivity of the full-circular n-type piezoresistor, orie
Publikováno v:
IEEE Transactions on Electron Devices. 67:646-651
Stress transducers play essential roles in diagnostic testing, monitoring, and nondestructive evaluation of many infrastructures. Particularly, 3-D piezoresistive (PR)-based stress sensors would tool up these applications with a high gauge sensing pl