Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Walide Chenniki"'
Autor:
Yves Ousten, Vincent Gaud, Isabelle Bord-Majek, Walide Chenniki, Mélanie Louarn, Komkrisd Wongtimnoi, Jean-Luc Diot
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2015, 55 (Issue 12-Part B), pp.2793-2798. ⟨10.1016/j.microrel.2015.06.057⟩
Microelectronics Reliability, Elsevier, 2015, 55 (Issue 12-Part B), pp.2793-2798. ⟨10.1016/j.microrel.2015.06.057⟩
International audience; Thermoplastic resins, such as Liquid Crystal Polymers (LCPs), have many attractive properties for microelectronic cavity package manufacturing (in particular low gas permeation and low dielectric constant). In order to reduce
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1221f19993e265de51fe26c644b4f24e
https://hal.archives-ouvertes.fr/hal-01255459
https://hal.archives-ouvertes.fr/hal-01255459
Autor:
Walide Chenniki, BORD MAJEK Isabelle, Mélanie Louarn, Vincent Gaud, Jean-Luc Diot, Komkrisd Wongtimnoi, Brunel, R., Yves Ousten
Publikováno v:
Fourth International Conference on Multifunctional, Hybrid and Nanomaterials (Hybrid Materials 2015)
Fourth International Conference on Multifunctional, Hybrid and Nanomaterials (Hybrid Materials 2015), Mar 2015, Sitges, Spain
HAL
Fourth International Conference on Multifunctional, Hybrid and Nanomaterials (Hybrid Materials 2015), Mar 2015, Sitges, Spain
HAL
International audience; The development of a new generation of innovative thermoplastics for microelectronic and photonic applications is essential to make cavity packages able to compete with ceramic packages in terms of cost and design flexibility.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::bab24987fdd2abd45f9225d2cc4d2de5
https://hal.archives-ouvertes.fr/hal-01188923
https://hal.archives-ouvertes.fr/hal-01188923
Autor:
Walide Chenniki, BORD MAJEK Isabelle, Mélanie Louarn, Vincent Gaud, Jean-Luc Diot, Bruno Levrier, Virginie Verriere, Thomas Frank, Komkrisd Wongtimnoi, Yves Ousten
Publikováno v:
Proceedings EMPC 2013
EMPC 2013 European Microelectronics Packaging Conference
EMPC 2013 European Microelectronics Packaging Conference, Sep 2013, Grenoble, France. pp.WA3-Chenniki
HAL
EMPC 2013 European Microelectronics Packaging Conference
EMPC 2013 European Microelectronics Packaging Conference, Sep 2013, Grenoble, France. pp.WA3-Chenniki
HAL
International audience
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::9f7d3f4b07608b6d7b6d1cc4bcb5c0e1
https://hal.archives-ouvertes.fr/hal-00934255
https://hal.archives-ouvertes.fr/hal-00934255
Autor:
Walide Chenniki, BORD MAJEK Isabelle, Jean-Luc Diot, Bruno Levrier, Yves Ousten, Eddy Romain-Latu, Virginie Verriere, Julien Vittu
Publikováno v:
HAL
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::82dfead11fbac51bc04a58626fc0226b
https://hal.archives-ouvertes.fr/hal-00714005
https://hal.archives-ouvertes.fr/hal-00714005