Zobrazeno 1 - 10
of 20
pro vyhledávání: '"Walder Andre"'
Autor:
Walder Andre
Here, we present a modified version of the Karatsuba algorithm to facilitate the FPGA-based implementation of three signed multipliers: 32-bit × 32-bit, 128-bit x 128-bit, and 512-bit × 512-bit. We also implement the conventional 32-bit × 32-bit m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::720e4fba9b4aa666993c9b5493068c9e
https://zenodo.org/record/4704276
https://zenodo.org/record/4704276
Publikováno v:
Novel Advances in Microsystems Technologies and Their Applications ISBN: 9781315216188
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::653b9488d906f217d367fdec4863a437
https://doi.org/10.1201/b15283-6
https://doi.org/10.1201/b15283-6
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 21:2024-2033
We describe, in this paper, a new digital input-output power configurable PAD (CPAD) for a wafer-scale-based rapid prototyping platform for electronic systems. This wafer-scale platform includes a reconfigurable wafer-scale circuit that can interconn
Autor:
Walder Andre, Olivier Couillard
Publikováno v:
International Journal of Reconfigurable and Embedded Systems (IJRES). 7:167
One of the prerequisites of Electronic Warfare (EW) is to have the means to provide secure point-to-point wireless data and voice communications with other ground stations. New technologies are giving rise to bigger information security threats. This
Autor:
Sylvain Martel, Walder Andre
Publikováno v:
IEICE Electronics Express. 5:101-106
A new architecture allowing an increase of the photocurrent of a photovoltaic cell fabricated with a CMOS 0.18µm process is described. This cell has been designed specifically to power the onboard electronics of a 400µm × 600µm untethered microro
Publikováno v:
ISCAS
The concept of sending and receiving analog signals through a digital interconnection network is presented in this paper. The proposed “analog bus” addresses limitations of a novel rapid prototyping platform called the WaferBoard™ that was init
Publikováno v:
Advanced Applications of Rapid Prototyping Technology in Modern Engineering
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::41f0e908e5e8222819f1260cf1f2d5a2
https://doi.org/10.5772/22838
https://doi.org/10.5772/22838
Publikováno v:
2011 IEEE 9th International New Circuits and systems conference.
This paper introduces the power supply analysis of a large area integrated circuit (LAIC) used in a rapid prototyping platform for electronic systems. User integrated circuits deposited on this active LAIC surface receive power through configurable I
Autor:
Moufid Radji, Anas A. Hamoui, Yves Blaquiere, Walder Andre, Ricardo Izquierdo, Mamadou D. Diop
Publikováno v:
19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems.
This paper presents the electrical characterization of annular TSV technology for full wafer applications. A possible utilization of this technology is the WaferBoard™, a reconfigurable circuit board for rapid system prototyping. Electrical resista
Autor:
Sylvain Martel, Walder Andre
Publikováno v:
2009 Joint IEEE North-East Workshop on Circuits and Systems and TAISA Conference.
Standard transmission methods such as RF have been considered for untethered robots that need to send messages and information to an external computer. But, as the overall sizes of such robots decrease, the implementation of such transmission systems