Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Wai Mun Yee"'
Autor:
Ooi Yin Shaung, Fong Jenn Haw, Syazana J D B T Waqiyuddin, Cho Naing, Lau Chiew Lui, Yip Kar Jun, Wai Mun Yee
Publikováno v:
European Journal of Cancer Prevention. 23:71-75
The aims of the study were (i) to determine the knowledge and perceptions of colorectal cancer (CRC), (ii) to explore the willingness of the study population to take a screening test for CRC, and (iii) to identify factors affecting the willingness to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ab9cf123bce282517e53267598347609
https://doi.org/10.1097/cej.0b013e328362e9b4
https://doi.org/10.1097/cej.0b013e328362e9b4
Autor:
Travis Eiles, Wai Mun Yee, Richard H. Livengood, Valluri R. Rao, Mario J. Paniccia, Paul Winer
Publikováno v:
Microelectronic Engineering. 46:27-34
Methods and techniques for micromachining and probing C4 packaged microprocessors from the silicon backside are described. The micromachining technique is based on using a combination of Laser Chemical Etching and Focused Ion Beam milling to open pre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ffdb704547f1975a0960a283f9948a9
https://doi.org/10.1016/s0167-9317(99)00009-x
https://doi.org/10.1016/s0167-9317(99)00009-x
Laser Voltage Probe (LVP): A Novel Optical Probing Technology for Flip-Chip Packaged Microprocessors
Publikováno v:
International Symposium for Testing and Failure Analysis.
A novel optical probing technique to measure voltage waveforms from flip-chip packaged complementary metal-oxide-semiconductor (CMOS) integrated circuits (IC) is described. This infrared (IR) laser based technique allows signal waveform acquisition a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::826cb803b7c9b8c2509c38d7b36e9833
https://doi.org/10.31399/asm.cp.istfa2000p0003
https://doi.org/10.31399/asm.cp.istfa2000p0003
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 16:3625
A method to optically probe flip chip packaged complementary metal–oxide–semiconductor (CMOS) microprocessors is described. The technique utilizes an infrared laser with a wavelength of 1064 nm to probe the electric field and the free carrier ind
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5636e9c33fd1fe895bdb2649cdf4052c
https://doi.org/10.1116/1.590316
https://doi.org/10.1116/1.590316
Publikováno v:
Proceedings of the 1999 7th International Symposium on the Physical & Failure Analysis of Integrated Circuits (Cat No99TH8394); 1999, p15-20, 6p
Publikováno v:
Proceedings International Test Conference 1998 (IEEE Cat No98CH36270); 1998, p740-747, 8p
Conference
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Conference
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