Zobrazeno 1 - 10
of 8 093
pro vyhledávání: '"Wafer-Bonding"'
Publikováno v:
Neue Verpackung. 10/22/2024, p34-37. 4p.
Autor:
Takeuchi, Kai1 (AUTHOR) kai.takeuchi@tohoku.ac.jp, Suga, Tadatomo2 (AUTHOR), Higurashi, Eiji1 (AUTHOR)
Publikováno v:
Scientific Reports. 1/13/2024, Vol. 14 Issue 1, p1-8. 8p.
Autor:
Zhao, Liang1 (AUTHOR) l-zhao-4x5@eagle.sophia.ac.jp, Periyanayagam, Gandhi Kallarasan1 (AUTHOR), Yada, Ryosuke1 (AUTHOR), Zhang, Junyu1 (AUTHOR), Kuroi, Mizuo1 (AUTHOR), Shimomura, Kazuhiko1 (AUTHOR)
Publikováno v:
Physica Status Solidi. A: Applications & Materials Science. Nov2024, p1. 6p. 13 Illustrations.
Autor:
Li, Hanchao1 (AUTHOR) e210181@e.ntu.edu.sg, Xie, Hanlin2 (AUTHOR), Wang, Yue3 (AUTHOR), Yulia, Lekina4 (AUTHOR), Ranjan, Kumud5 (AUTHOR), Singh, Navab2 (AUTHOR), Chung, Surasit2 (AUTHOR), Lee, Kenneth E.3 (AUTHOR), Arulkumaran, Subramaniam5 (AUTHOR), Ing Ng, Geok1,2,3 (AUTHOR) EGING@ntu.edu.sg
Publikováno v:
Physica Status Solidi. A: Applications & Materials Science. Nov2024, Vol. 221 Issue 21, p1-6. 6p.
Autor:
Thiel, Lillian1 (AUTHOR) lthiel@ucsb.edu, Castro, Joshua E.1 (AUTHOR), Steiner, Trevor J.2 (AUTHOR), Nguyen, Catherine L.3 (AUTHOR), Pechilis, Audrey4 (AUTHOR), Duan, Liao4 (AUTHOR), Lewis, Nicholas1 (AUTHOR), Cole, Garrett D.3 (AUTHOR), Bowers, John E.1,2 (AUTHOR), Moody, Galan1 (AUTHOR) moody@ucsb.edu
Publikováno v:
Applied Physics Letters. 9/23/2024, Vol. 125 Issue 13, p1-6. 6p.
Autor:
Zhang, Yuqian1 (AUTHOR), Sun, Changzheng1 (AUTHOR) czsun@tsinghua.edu.cn, Xiong, Bing1 (AUTHOR), Wang, Jian1 (AUTHOR), Hao, Zhibiao1 (AUTHOR), Wang, Lai1 (AUTHOR), Han, Yanjun1 (AUTHOR), Li, Hongtao1 (AUTHOR), Luo, Yi1 (AUTHOR)
Publikováno v:
Applied Physics Letters. 8/26/2024, Vol. 125 Issue 9, p1-7. 7p.
Autor:
Chen, Wan-Ting1,2 (AUTHOR) 202234052@mail.sdu.edu.cn, Liu, Li1 (AUTHOR) liulisddx@mail.sdu.edu.cn, Zhao, Jia1,2 (AUTHOR) zhaojia@sdu.edu.cn, Zhang, Chen1,2 (AUTHOR) zhaojia@sdu.edu.cn
Publikováno v:
Nanomaterials (2079-4991). Apr2024, Vol. 14 Issue 8, p709. 13p.
Autor:
Persson, B. N. J.1,2 (AUTHOR) b.persson@fz-juelich.de, Mate, C. Mathew3 (AUTHOR)
Publikováno v:
European Physical Journal B: Condensed Matter. Apr2024, Vol. 97 Issue 4, p1-13. 13p.
Autor:
Feng, Wei1 (AUTHOR) wei.feng@aist.go.jp, Shimamoto, Haruo1 (AUTHOR) haruo.shimamoto@aist.go.jp, Kawagoe, Tsuyoshi2 (AUTHOR) t.kawagoe@ultramemory.co.jp, Honma, Ichirou2 (AUTHOR) i.homma@ultramemory.co.jp, Yamasaki, Masato2 (AUTHOR) m.yamasaki@ultramemory.co.jp, Okutsu, Fumitake2 (AUTHOR) f.okutsu@ultramemory.co.jp, Masuda, Takatoshi2 (AUTHOR) t.masuda@ultramemory.co.jp, Kikuchi, Katsuya1 (AUTHOR) k-kikuchi@aist.go.jp
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. Aug2023, Vol. 36 Issue 3, p398-403. 6p.