Zobrazeno 1 - 10
of 719
pro vyhledávání: '"Wafer backgrinding"'
Autor:
M. Tsujimura
The rotary table method is most commonly used in several CMP methods today. In this method, a pad is affixed to a table, slurry is dropped onto the pad, a wafer is pressed against the pad with the wafer's face facing down, and the table and wafer are
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::784a0468c0ace858156a491539b7ddae
https://doi.org/10.1016/b978-0-12-821791-7.00015-0
https://doi.org/10.1016/b978-0-12-821791-7.00015-0
Publikováno v:
Journal of Engineering Research and Reports. :1-6
The continuous development and trends on thinner semiconductor packages have become the focus in the semiconductor industry. The necessity of thinner packages also demands a thinner vertical structure of the integrated circuit (IC) design. As a major
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ea9d1ac9b4687094e45a611069727416
https://doi.org/10.9734/jerr/2019/v6i216943
https://doi.org/10.9734/jerr/2019/v6i216943
Publikováno v:
Materials Science in Semiconductor Processing. 71:133-138
A higher yield and lower processing cost for the production of the silicon wafer can be realized by reducing the sliced thickness. However, a larger fracture probability is accompanied with the thinner silicon wafer, which limits the wafer thickness
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::39b5182e45a66c9b60f6bcb9b26f97f7
https://doi.org/10.1016/j.mssp.2017.07.022
https://doi.org/10.1016/j.mssp.2017.07.022
Publikováno v:
Energy Procedia. 130:2-6
Silicon remains the dominant technology worldwide in the PV industry and a tremendous amount of cumulative industry advances have given product based on multicrystalline wafers the lowest LCOE in the market. However, new technologies are emerging tha
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15ea526c032af9b1a1847632d38bfceb
https://doi.org/10.1016/j.egypro.2017.09.403
https://doi.org/10.1016/j.egypro.2017.09.403
Autor:
Kamal Taha
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 30:176-184
A semiconductor wafer undergoes various processing steps before it is transformed from a plain silicon wafer to one populated with thousands of integrated circuits. Each of these processing steps is susceptible to specific types of defects. Some defe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f36cd91d7dd828922c9bc71c7286a277
https://doi.org/10.1109/tsm.2017.2679714
https://doi.org/10.1109/tsm.2017.2679714
Publikováno v:
Angewandte Chemie International Edition. 56:5720-5724
Silicon wafers have been widely used in the semiconductor industry for many decades. Over the past decades, with the development of organic optoelectronic materials, silicon-based organic-inorganic hybrid devices have received more and more interest
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::813349ca2c59f2d171e497fa10cc94f6
https://doi.org/10.1002/anie.201700039
https://doi.org/10.1002/anie.201700039
Publikováno v:
Journal of the Japan Society for Precision Engineering. 83:433-438
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0f39b5c8c3f104fea0352a582219feea
https://doi.org/10.2493/jjspe.83.433
https://doi.org/10.2493/jjspe.83.433
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2017:1-26
Driven largely by the growing need for more data, increased functionality, and faster speeds, consumer electronic devices have sparked a revolution in IC design. As it becomes increasingly more expensive and technically challenging to scale down semi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e51aa1b05011ac63898bf96353f34c4
https://doi.org/10.4071/2017dpc-wp2_presentation1
https://doi.org/10.4071/2017dpc-wp2_presentation1
Autor:
Akiyuki Minami, Kuniaki Yagi, Hidetsugu Uchida, Naoki Hatta, Motoki Kobayasi, Hideki Takagi, Toyokazu Sakata, Takamitsu Kawahara
Publikováno v:
Journal of the Japan Society for Precision Engineering. 83:833-836
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d4c34f0297c8c580fa3519ea6e455e71
https://doi.org/10.2493/jjspe.83.833
https://doi.org/10.2493/jjspe.83.833
Autor:
Seong-Min Lee
Publikováno v:
MATERIALS TRANSACTIONS. 58:530-534
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::104ce2bd4aa8128100aa7dac2e7539b1
https://doi.org/10.2320/matertrans.m2016366
https://doi.org/10.2320/matertrans.m2016366