Zobrazeno 1 - 10
of 203
pro vyhledávání: '"WARPAGE in electronic circuits"'
Autor:
Hu Zhen1 leslie.hu@jcetglobal.com, Zhao Wei1, Gu Xiao1, Chen Dong1, Chen Haijie1, Xu Hong1, Kim Hwee Tan1
Publikováno v:
Journal of Microelectronic & Electronic Packaging. 2022, Vol. 19 Issue 3, p89-94. 6p.
Autor:
Kwak, Jae B.1 jaekwak@chosun.ac.kr
Publikováno v:
International Journal of Advanced Manufacturing Technology. Feb2019, Vol. 100 Issue 9-12, p2803-2811. 9p.
Publikováno v:
Journal of Microelectronic & Electronic Packaging. Jan2019, Vol. 16 Issue 1, p13-20. 8p.
Autor:
Yasin, Saiful Bahri Mohd1,2 sbmyasin@gmail.com, Mohd, Nur Fatiah1, Mahmud, Jamaluddin2, Whashilah, Nabihah Shaibol1, Razak, Zakaria3
Publikováno v:
International Journal of Advanced Manufacturing Technology. Oct2018, Vol. 98 Issue 9-12, p2531-2537. 7p. 7 Color Photographs, 3 Diagrams, 3 Charts, 1 Graph.
Autor:
Kang, Sungbum1, Ume, I. Charles2 charles.ume@me.gatech.edu
Publikováno v:
International Journal of Advanced Manufacturing Technology. Jun2018, Vol. 96 Issue 9-12, p3235-3249. 15p.
Autor:
Loh, Wei Keat1, Haley Fu2
Publikováno v:
SMT: Surface Mount Technology. Jul2016, Vol. 31 Issue 7, p68-76. 7p.
Autor:
Liang Wang1 lwang@invensas.com, Woychik, Charles G.1, Guilian Gao1, Villavicencio, Grant1, McGrath, Scott1, Hong Shen1, Arkalgud, Sitaram1
Publikováno v:
Journal of Microelectronic & Electronic Packaging. 2015 3rd Quarter, Vol. 12 Issue 3, p123-128. 6p.
Autor:
Woon-Seong Kwon1 woonseo@xilinx.com, Ramalingam, Suresh1, Xin Wu1, Madden, Liam1, Huang, C. Y.2, Hung-Hsien Chang2, Chi-Hsin Chiu2, Chiu, Steve2, Chen, Stephen2
Publikováno v:
Journal of Microelectronic & Electronic Packaging. 2015 3rd Quarter, Vol. 12 Issue 3, p111-117. 7p.
Autor:
Sungbum Kang1, Charles Ume, I.1 charles.ume@me.gatech.edu
Publikováno v:
Journal of Microelectronic & Electronic Packaging. 2015, Vol. 12 Issue 2, p104-110. 7p.
Publikováno v:
IEEE Transactions on Components, Packaging & Manufacturing Technology. Apr2019, Vol. 9 Issue 4, p786-796. 11p.