Zobrazeno 1 - 10
of 846
pro vyhledávání: '"WAFER-scale integration of circuits"'
Controlled crack propagation for atomic precision handling of wafer-scale two-dimensional materials.
Autor:
Shim, Jaewoo1,2 (AUTHOR), Bae, Sang-Hoon1,2 (AUTHOR), Wei Kong1,2 (AUTHOR), Doyoon Lee1,2 (AUTHOR), Kuan Qiao1,2 (AUTHOR), Nezich, Daniel3 (AUTHOR), Yong Ju Park4 (AUTHOR), Zhao, Ruike1,5 (AUTHOR), Sundaram, Suresh6 (AUTHOR), Xin Li6 (AUTHOR), Yeon, Hanwool1,2 (AUTHOR), Choi, Chanyeol1,2 (AUTHOR), Hyun Kum1,2 (AUTHOR), Yue, Ruoyu7 (AUTHOR), Guanyu Zhou7 (AUTHOR), Yunbo Ou8 (AUTHOR), Kyusang Lee1,2,9 (AUTHOR), Moodera, Jagadeesh8 (AUTHOR), Xuanhe Zhao1 (AUTHOR), Ahn, Jong-Hyun4 (AUTHOR)
Publikováno v:
Science. 11/9/2018, Vol. 362 Issue 6415, p665-670. 6p. 1 Color Photograph.
Autor:
ZAFER, Baha1 baha.zafer@istanbul.edu.tr, TUNABOYLU, Bahadır2
Publikováno v:
Turkish Journal of Electrical Engineering & Computer Sciences. 2016, Vol. 24 Issue 5, p3513-3523. 11p.
Publikováno v:
Production Planning & Control. Jul2005, Vol. 16 Issue 5, p426-436. 11p.
Autor:
Jungkil Kim1, Si Duk Oh1, Ju Hwan Kim1, Dong Hee Shin1, Sung Kim1, Suk-Ho Choi1 sukho@khu.ac.kr
Publikováno v:
Scientific Reports. 6/20/2014, p1-5. 5p.
Autor:
Wiegner, Kathleen K.
Publikováno v:
Forbes. 3/4/1991, Vol. 147 Issue 5, p119-120. 2p. 2 Color Photographs.
Autor:
Justice, John1, Bower, Chris2, Meitl, Matthew2, Mooney, Marcus B.3, Gubbins, Mark A.3, Corbett, Brian1
Publikováno v:
Nature Photonics. Sep2012, Vol. 6 Issue 9, p612-616. 5p. 1 Diagram, 3 Graphs.
Autor:
Kidd, Steve1 skidd@mellesgriot.com, Pearson, Matt2 matt.pearson@Inloptenia.com, Sayavong, Boumy2 boumy.sayavong@Inloptenia.com
Publikováno v:
Laser Focus World. Mar2004, Vol. 40 Issue 3, p71-76. 4p. 3 Color Photographs, 1 Graph.
Publikováno v:
International Journal of Advanced Manufacturing Technology. Dec2006, Vol. 31 Issue 7/8, p705-715. 11p. 2 Diagrams, 3 Charts, 15 Graphs.
Autor:
Indiveri, Giacomo1
Publikováno v:
Neural Computation. Dec2000, Vol. 12 Issue 12, p2857-2880. 24p. 6 Diagrams, 6 Graphs.
Autor:
Smith, Anderson D.1, Malm, B. Gunnar1, Ostling, Mikael1, Wagner, Stefan2, Kataria, Satender2, Lemme, Max C.2
Publikováno v:
IEEE Transactions on Electron Devices. Sep2017, Vol. 64 Issue 9, p3927-3933. 7p.