Zobrazeno 1 - 10
of 177
pro vyhledávání: '"W.H. Muller"'
Publikováno v:
Mycologia. 90:170-179
Techniques of freeze-fracturing and cyto- plasmic maceration were combined to reveal the sep- tal pore cap in some members of the Rhizoctonia s.l. complex by the use of field emission gun-scanning
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::27247e42eaa26fe04cec49eab0a9768f
https://doi.org/10.1080/00275514.1998.12026896
https://doi.org/10.1080/00275514.1998.12026896
Publikováno v:
3rd Electronics System Integration Technology Conference ESTC.
This work presents some recent progresses in reliability assessment of electronic assemblies in automotive industry and shows how coupled numerical-experimental techniques can help us save time and reduce the cost of IC package qualification. In orde
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c1b284e92f6b5633ca7b6bbf7bbb8197
https://doi.org/10.1109/estc.2010.5642815
https://doi.org/10.1109/estc.2010.5642815
Publikováno v:
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
Experimental and FEM studies have been undertaken in order to characterize the non-Fickian behavior of moisture absorption, temperature-dependent residual moisture content and hygroscopic swelling of epoxy molding compounds exposed to moist environme
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::431d97980ef1f2bd5ea728542dc2c042
https://doi.org/10.1109/esime.2008.4525009
https://doi.org/10.1109/esime.2008.4525009
Coarsening Processes in the Lead-free Solder Alloy AgCu: Theoretical and Experimental Investigations
Autor:
T. Bohme, W.H. Muller
Publikováno v:
2005 7th Electronic Packaging Technology Conference.
Experimental investigations show that the microstructure of solders changes over time. In order to estimate the reliability and the lifetime of microelectronic solder materials it is important to predict the rate of microstructural change. Starting w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7c420e8a69df9e6da4d8775398e0c310
https://doi.org/10.1109/eptc.2005.1614475
https://doi.org/10.1109/eptc.2005.1614475
Autor:
W.H. Muller, T. Bohme
Publikováno v:
2006 8th Electronics Packaging Technology Conference.
The reliable behavior of solder joints is a well-known key issue for the microelectronic industry. From the technological point-of-view SMT solders guarantee the electrical and mechanical bonding on a printed circuit board. Recently, environmental te
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::06e6e212ccfbb1644ce9c1760aebc440
https://doi.org/10.1109/eptc.2006.342748
https://doi.org/10.1109/eptc.2006.342748
Publikováno v:
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
Focus of this paper is the prediction of silicon fracture in microchips of electronic devices. The strength of silicon chips strongly depends on flaw distributions introduced by wafer manufacturing processes. Consequently strength data scatter and a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c0e3f59bd059d5e2f8f009472849e78f
https://doi.org/10.1109/esime.2005.1502808
https://doi.org/10.1109/esime.2005.1502808
Publikováno v:
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
The reliability of semiconductor devices in automotive environmental conditions requires optimized package design with respect to geometry, materials and manufacturing processes. Process steps at high temperatures can result in high package stresses
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::00a7b454c4d130811d9b80ce7b51f2e6
https://doi.org/10.1109/esime.2004.1304025
https://doi.org/10.1109/esime.2004.1304025
Publikováno v:
4th Electronics Packaging Technology Conference, 2002..
This paper concentrates on open problems regarding recently published work in the field of modeling micromorphological changes in lead-free solders using phase field theories of the Cahn-Hilliard type. Specific examples will be eutectic SnPb, SnAg, a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3825f258a27688beaf4a84253976e057
https://doi.org/10.1109/eptc.2002.1185706
https://doi.org/10.1109/eptc.2002.1185706
Autor:
B. Schwarz, W.H. Muller, Ch. Birzer, Rainer Tilgner, H. Teichmann, H. Pape, J. Jendrny, J.-J. Albrecht
Publikováno v:
Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235).
The fatigue and damage of solder joints and the potential for interface failure within chip scale packages (CSP) are primarily caused by thermal loading. The thermally induced residual stresses depend on the thermal mismatch encountered during therma
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bf4a582d9d6c8795c3cd0b8b092cbf2f
https://doi.org/10.1109/eptc.1998.755998
https://doi.org/10.1109/eptc.1998.755998
Autor:
W.H. Muller, W. Dreyer
Publikováno v:
Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456).
This paper presents a quantitative computer simulation of the coarsening phenomenon observed in eutectic tin/lead and other solder materials used for joining microelectronic components. The mathematical model is based on phase field theory and allows
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::47f207e16527fa43dccd73d30f5f9d8f
https://doi.org/10.1109/eptc.2000.906359
https://doi.org/10.1109/eptc.2000.906359