Zobrazeno 1 - 1
of 1
pro vyhledávání: '"W.H. Miillera"'
Publikováno v:
2006 8th Electronics Packaging Technology Conference.
This main objective of this paper is to use a finite element analysis of the state of stress and strain within an intermetallic layer at the interface of a lead-free solder joint for an investigation of the comparatively unknown fracture mechanics pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1d3cb0bf88520f775730a0740dcdeaad
https://doi.org/10.1109/eptc.2006.342701
https://doi.org/10.1109/eptc.2006.342701
