Zobrazeno 1 - 3
of 3
pro vyhledávání: '"W.F.A. Lau"'
Autor:
J. Cheah, E.-H. Kwek, null Eng Chuan Low, null Chee Kwang Quek, C. Yong, R. Enright, J. Hirbawi, A. Lee, null Hongyu Xie, null Longyin Wei, null Le Luong, null Jianping Pan, null Shih-Tsung Yang, W.F.A. Lau, null Wai-Lim Ngai
Publikováno v:
2002 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.02CH37315).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::25115087721075c5f306805a42ad4769
https://doi.org/10.1109/isscc.2002.992113
https://doi.org/10.1109/isscc.2002.992113
Autor:
Ee-Hong Kwek, Jonathon Y. Cheah, J. Hirbawi, Longyin Wei, W.F.A. Lau, Eng Chuan Low, R. Enright, Shih-Tsung Yang, Le Luong, Chee Kwang Quek, Hongyu Xie, Jianping Pan, Yong Chee Hong, Wai-Lim Ngai, A. Lee
Publikováno v:
2002 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.02CH37315).
A complete 0.25 /spl mu/m CMOS SOC Bluetooth solution adopts a two-die in a single MCM chip packaging approach with minimum product cost as the most important design goal while maintaining competitive power consumption and RF performance.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8533717dd44fb3a7436fc945b3be3f71
https://doi.org/10.1109/isscc.2002.992953
https://doi.org/10.1109/isscc.2002.992953
Conference
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